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 | Design Considerations in the Selection of High Frequency Materials for PCB Base Station Antennas
By Allen F. Horn III and Art Aguayo, Rogers Corporation
Winter 2011
Originally published in the Winter 2011 edition of an Antenna publication
English (487 KB) |
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 | Improved Thermal Management of Microwave PCBs Using Advanced Circuit Materials
By John Coonrod, Rogers Corporation
November 2011
Featured in November 2011 issue of Microwave Journal
English (1 MB) |
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 | High Frequency Laminates Help Avoid Car Accidents
By John Coonrod, Rogers Corporation
October 2011
Featured in Oct 2011 issue of the pcb magazine
English (1 MB) |
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 | Selecting PCBs for Mobile Infrastructures
By Art Aguayo, Sr. Market Development Manager
October 2011
Featured in Sept/Oct 2011 issue of Wireless Design & Development
English (205 KB) |
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 | Tackling Thermal issues in Microwave PCBs
By John Coonrod, Rogers Corporation Advanced Circuit Materials Division
October 2011
Featured in Microwave Product Digest
English (971 KB) |
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 | Understanding When To Use FR-4 Or High Frequency Laminates
By John Coonrod, Rogers Corporation Advanced Circuit Materials Division
September 2011
Featured in On Board technology
English (409 KB) |
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 | Having Lead-Free Soldering Issues
By John Coonrod, Rogers Corporation
October 2011
Featured in Oct 2011 issue of the pcb magazine
English (644 KB) |
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 | Understanding Dielectric Constant for Microwave PCB Materials
By John Coonrod & Allen F. Horn III, Rogers Corporation Advanced Circuit Materials Division
July 2011
Featured in High Frequency Electronics
English (354 KB) |
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 | Should You Be Using a High-Frequency Laminate Instead of FR-4?
By John Coonrod, Rogers Corporation
June 2011
Featured in pcb magazine (Electronic Edition)
English (3 MB) |
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 | Thermal Design Begins At The Circuit Board
By John Coonrod, Rogers Corporation Advanced Circuit Materials Division
May 2011
Featured in MicroWaves & RF
English (1 MB) |
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 | Methods for Characterizing the Dielectric Constant of Microwave PCB Laminates
By John Coonrod, Rogers Corporation Advanced Circuit Materials Division
May 2011
Featured in Microwave Journal
English (4 MB) |
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 | Product Feature - Circuit Laminate Keeps The Heat Out
By John Coonrod, Rogers Corporation Advanced Circuit Materials Division
April 2011
Featured in MicroWaves & RF
English (831 KB) |
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 | High-Frequency Laminates Provide Foundation for Advanced Mobile Networks
By Art Aguayo, Jr., Rogers Corporation Advanced Circuit Materials Division
December 2010
Featured in Microwave Engineering Europe
English (5 MB) |
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 | High Frequency Circuit Materials with Increased Thermal Conductivity
By Allen F. Horn III and John Coonrod, Rogers Corporation
November 2010
Featured in High Frequency Electronics
English (363 KB) |
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 | Advances in High-Frequency PCB Materials
By Art Aguayo, Rogers Corporation
October 2010
Featured in Defense Tech Briefs
English (1 MB) |
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 | Integral Planar Resistors Save Circuit Board Space
October 2010
Featured in Microwave Journal
English (3 MB) |
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 | Miniaturize Microwave Power Amplifiers by Means of PCB Materials Selection
By John Coonrod, Rogers Corporation
October 2010
Featured in Microwave Product Digest
English (1 MB) |
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 | Considerations When Choosing High Frequency Laminates
By John Coonrod, Rogers Corporation
August 2010
Featured in CircuiTree Magazine
English (811 KB) |
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 | New High Frequency PCB Materials for the Power Amplifier Industry
By John Coonrod, Rogers Corporation
May 2010
Featured in May 2010 issue of Microwave Journal
English (1 MB) |
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 | Properties of Low Dielectric Constant Laminates
By John Coonrod, Rogers Corporation
March 2010
Featured in ACI Technologies Inc, Monthly Newsletter (empfasis , March 2010)
English (843 KB) |
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 | Effect of conductor profile on the insertion loss, phase constant, and dispersion in thin high frequency transmission lines
February 2010
Presented at DesignCon 2010
Written By: Allen F. Horn III, Rogers Corporation, John W. Reynolds, Rogers Corporation, Patricia A. LaFrance, Rogers Corporation, James C. Rautio, Sonnet Software
English (860 KB) |
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 | Analyzing Advances in Antenna Materials
By Art Aguayo, Rogers Corporation
December 2009 / January 2010
Featured in December 2009 / January 2010 issue of Antenna Systems and Technology
English (3 MB) |
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| Advances in High Frequency Printed Circuit Board Materials
by Art Aguayo, Rogers Corporation
December 2009
Featured in December 2009 issue of Microwave Engineering Europe
English (2 MB) |
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| Microwave Materials Lay Foundation for PAs
By John Coonrod, Market Development Engineer, Rogers Corporation
December 2009
Featured in December 2009 issue of Microwaves and RF
English (1 MB) |
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| Low Density Laminate Overcomes PTFE Limitations
By Rogers Corporation
October 2009
Featured in October 2009 issue of Microwave Journal magazine
English (583 KB) |
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| Rogers Corp Executive Interview - Jim Carroll, Director of Marketing
October 2009
Featured in October 2009 issue of Microwave Journal
English (96 KB) |
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| Thin Printed Circuit Board Laminates in High Frequency Applications
by John Coonrod and Art Aguayo, Rogers Corporation
August 2009
Featured in August 2009 issue of CircuiTree magazine
English (680 KB) |
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| Advances in High Frequency Materials
By Art Aguayo, Rogers Corporation
June 2009
Featured in June 2009 issue of Microwave Engineering Europe
English (651 KB) |
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| An Overview of Material Options Suitable for Today's Commercial Millimeter Wave Designs
By Scott Kennedy, Al Horn, and Greg Bull
With Fuhan Liu, Hunter Chan, Venky Sundaram, and Rao Tummala (Georgia Tech)
May 2009
Featured in May 2009 issue of CircuiTree magazine
English (431 KB) |
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| High Frequency Circuit Materials Attributes
by John Coonrod, Rogers Corporation
English (430 KB) |
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| New Developments in High Frequency Printed Circuit Board
By John Coonrod, Market Development Engineer, Rogers Corporation
March 2009
Featured in March 2009 issue of Microwave Product Digest
English (2 MB) |
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