Advanced Circuit Materials
Connecting Our World
In our Advanced Circuit Materials Division, we manufacture high frequency laminates that enable a more connected world. Applications include wireless base station, aerospace and defense, automotive, high-speed digital and advanced chip packaging industries. All of our products are manufactured in an ISO-9001:2008 certified facility with "ahead of the curve" process technology.
Our customers include Original Equipment Manufacturers (OEM) and printed circuit board fabricators (from quick-turn prototype shops to high volume corporations) for advanced electronic applications. We serve customers around the globe with manufacturing facilities and customer support in Asia, Europe, and North America.
How We Work with You
We work closely with your product designers to anticipate rapidly changing needs and technological advances, and we manufacture products to your exact performance requirements. Then we provide all the necessary training and technical support to ensure that our materials work perfectly in your processes. We are committed to helping you to meet intense competition with unique high-performance solutions.
Materials for use in high performance, high reliability multi-layer constructions including microwave stripline packages and other multilayer circuits.
Circuit materials with good dielectric characteristics suitable for high frequency signals, and superior heat resistance for high layer count boards and other high-speed digital applications.
High frequency circuit materials which offer exceptional electrical and mechanical stability and are used in commercial microwave and RF applications.
Laminates and prepregs which offer superior high frequency performance and low cost circuit fabrication. A low loss material that can be fabricated using standard epoxy/glass (FR4) processes.
RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
Rogers offers two types of thin, adhesiveless, copper clad laminates made using either liquid crystalline polymer (LCP) or a polyether ether ketone (PEEK) polymer as the dielectric film.
Rogers thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and the best dielectric constant uniformity of any substrate in the market.