Data Sheets | Size |
 | 3001 Bonding Film Properties and Laminating Techniques | English | 38 KB |
| 8080 Liquid Photoimageable Covercoat data sheet | English | 113 KB |
| 8080 Liquid Photoimageable Covercoat: LP2 | English | 82 KB |
| RO3000® Laminate Data Sheet: RO3003™, RO3006™, RO3010™ | English | 126 KB |
| RO3035™ Laminate Data Sheet | English | 60 KB |
| RO3200™ Laminate Data Sheet: RO3203™, RO3206™, RO3210™ | English | 96 KB |
| RO3730™ Antenna Grade Laminates Data Sheet | English | 93 KB |
| RO4000® High Frequency Laminate with TICER Foil | English | 31 KB |
| RO4000® Laminates - Data sheet | English | 191 KB |
| RO4000® LoPro™ Laminates | English | 113 KB |
| RO4400™ Series Prepreg Data Sheet: RO4450B™ and RO4450F™ Prepregs | English | 65 KB |
| RO4500™ Antenna Grade Laminates for High Volume Applications | English | 82 KB |
| RO4730™ LoPro™ Antenna Grade Laminate Data Sheet | English | 93 KB |
| RT/duroid 5870/ 5880 Data Sheet | English | 65 KB |
| RT/duroid 5880LZ High Frequency Laminates | English | 97 KB |
| RT/duroid 6002 laminate data sheet | English | 60 KB |
| RT/duroid 6006/6010 laminate data sheet | English | 64 KB |
| RT/duroid 6202 laminate data sheet | English | 59 KB |
| RT/duroid 6202PR laminate data sheet | English | 74 KB |
| RT/duroid® 6035HTC High Frequency Laminates | English | 172 KB |
| SYRON 7100 High Performance Circuit Materials Data Sheet | English | 92 KB |
| SYRON™ 7000 High Performance Circuit Materials | English | 60 KB |
| Theta™ Circuit Materials Data Sheet | English | 206 KB |
| TMM® Thermoset laminate data sheet: TMM3, TMM4, TMM6, TMM10, TMM10i | English | 42 KB |
| ULTRALAM® 3000 LCP laminate data sheet: ULTRALAM 3850 | English | 144 KB |
| ULTRALAM® 3000 LCP Prepreg: ULTRALAM® 3908 | English | 377 KB |
| XT/duroid 8100 High Frequency Circuit Materials Data Sheet | English | 94 KB |
| XT/duroid™ 8000 High Frequency Circuit Materials | English | 62 KB |
| RO4000 系列高频线路板材料 | 中文 | 318 KB |
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Electrical Design Data | Size |
| Design Data for Microstip Transmission Lines on RT/duroid Laminates | English | 112 KB |
| Design Data for Microstrip Transmission Lines of TMM Laminates | English | 118 KB |
| Design Equations for Broadside and Edgewise Stripline | English | 151 KB |
| Handling Continuous Power in Bonded Stripline of RT/duroid Laminates | English | 65 KB |
| Line Widths for Various Characteristic Impedance of Center Stripline Devices in a Variety of RT/duroid High Frequency Laminates | English | 155 KB |
| Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current | English | 34 KB |
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Fabrication Information | Size |
| 3001 Bonding Film Properties and Laminating Techniques | English | 38 KB |
| After Etch Stress Relief in RT/duroid Microwave Laminates | English | 20 KB |
| Bending Etched Antenna Boards | English | 37 KB |
| Bonding PTFE Materials for Microwave Stripline Packages and Other Multilayer Circuits | English | 83 KB |
| Device Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency Laminates | English | 306 KB |
| Fabrication Guidelines for RO3000® and RO3200® Series High Frequency Circuit Materials | English | 38 KB |
| Fabrication Guidelines: RO4400® series prepregs. RO4450B™, RO4450F™ prepregs | English | 158 KB |
| Fabrication Guidelines: RT/duroid 6202PR High Frequency Laminates | English | 31 KB |
| Fabrication Guidelines: RT/duroid® 5880LZ High Frequency Laminates | English | 96 KB |
| Fabrication Guidelines: SYRON™ 7000 / 7100 High Performance Circuit Materials | English | 30 KB |
| Fabrication Guidelines: RO3730 Antenna Grade Laminates | English | 33 KB |
| Fabrication Guidelines: RO4000 LoPro™ laminates | English | 158 KB |
| Fabrication Guidelines: RO4000® Series Materials | English | 64 KB |
| Fabrication Guidelines: RO4730™ LoPro™ Antenna Grade Laminate | English | 127 KB |
| Fabrication Guidelines: RT/duroid 5870/5880 High Frequency Circuit Materials | English | 48 KB |
| Fabrication Guidelines: RT/duroid 6002/6006/6010 High Frequency Circuit Materials | English | 114 KB |
| Fabrication Guidelines: RT/duroid 6035HTC High Frequency Laminates | English | 33 KB |
| Fabrication Guidelines: TMM® High Frequency Laminates | English | 232 KB |
| Fabrication Guidelines: ULTRALAM 3000 LCP Materials | English | 94 KB |
| Fabrication Guidelines: XT/duroid 8000 / 8100 High Frequency CIrcuit Materials | English | 30 KB |
| Guidelines for Drilling RT/duroid 6002 Bonded Assemblies and Multilayer Boards | English | 16 KB |
| How to Avoid Creep on Board Assemblies | English | 35 KB |
| PTFE Safety Notes on Using RT/duroid Composite Material | English | 18 KB |
| Quick Reference Processing Guidelines: RO3000® and RO3200™ Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: RO3730 Antenna Grade Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: RO4003C/RO4350B High Frequency Laminates | English | 25 KB |
| Quick Reference Processing Guidelines: RO4730™ LoPro™ Antenna Grade Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: RT/duroid 6035HTC High Frequency Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: RT/duroid® 5880LZ High Frequency Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: SYRON™ 7000 / 7100 High Performance Circuit Material | English | 24 KB |
| Quick Reference Processing Guidelines: XT/duroid 8000 /8100 High Frequency Circuit Materials | English | 24 KB |
| RT/duroid 6002 Microwave Laminates Direct Bonding | English | 43 KB |
| The Prevention and Removal of Absorbed Chemicals in RT/duroid 6002 Microwave Laminates | English | 24 KB |
| The Prevention of Extraneous Secondary Plating of RT/duroid® High Frequency Laminates | English | 127 KB |
| Theta™ Circuit Materials Processing Guidelines | English | 41 KB |
| RO4400系列半固化片数据表 | 中文 | 158 KB |
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General | Size |
| Advanced Packaging: Organically Grown Wireless SiP Solutions | English | 480 KB |
| DNV ISO 9001:2008 Certificate | English | 122 KB |
| RoHS Certification Letter - Flexible Circuit Materials | English | 456 KB |
| RoHS Certification Letter - High Frequency Materials | English | 36 KB |
| |
Product Selection Guides | Size |
| High Frequency Laminates - Product Selector Guide and Standard Thicknesses and Tolerances | English | 643 KB |
| 高频产品选材指南 | 中文 | 975 KB |
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Properties - Detailed Characteristics | Size |
| A Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid 5870 Material | English | 110 KB |
| Copper Foils for High Frequency Circuit Materials | English | 672 KB |
| Good Performance of RT/duroid Microwave Laminate in a Cryogenic Stripline Application at NASA | English | 32 KB |
| Low Outgassing Characteristics | English | 22 KB |
| Properties Guide | English | 60 KB |
| Reliability and Key Properties of RT/duroid 6002 | English | 88 KB |
| RO4003 High Frequency Material Insertion Loss Comparison with Other Materials | English | 264 KB |
| RT/duroid PTFE-Based Composite Meets Flammability Requirements for Oxygen Environments | English | 30 KB |
| The Advantage of Nearly Isotropic Dielectric Constant of RT/duroid 5870-5880 Glass Microfiber PTFE | English | 119 KB |
| The Benefits of Selecting RT/duroid 6010LM for Band Pass Filters | English | 417 KB |
| The Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear Radiation | English | 93 KB |
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Technical Articles | Size |
| A Low Cost Laminate for Wireless Applications | English | 625 KB |
| An Overview of Material Options Suitable for Today's Commercial Millimeter Wave Designs
Scott Kennedy, Al Horn, and Greg Bull With Fuhan Liu, Hunter Chan, Venky Sundaram, and Rao Tummala | English | 2 MB |
| Rogers RT/duroid® Material Provides Flexible Substrates in New Conical Antenna | English | 211 KB |
| RT/duroid 5880LZ: Low Density Laminate Overcomes PTFE Limitations: MWJ Article 10/2009 | English | 583 KB |
| Thick Metal Cladding | English | 88 KB |