Literature

Data Sheets

Size
PDF2929 Bondply Data SheetEnglish90 KB
PDF3001 Bonding Film Properties and Laminating TechniquesEnglish212 KB
PDFMCL-HE-679G/ THETA® Circuit Materials Data SheetEnglish224 KB
PDFRO3000 Series Bondply - Data Sheet & Processing GuidelinesEnglish60 KB
PDFRO3000® Laminate Data Sheet: RO3003™, RO3006™, RO3010™English229 KB
PDFRO3035™ Laminate Data SheetEnglish60 KB
PDFRO3200™ Laminate Data Sheet: RO3203™, RO3206™, RO3210™English103 KB
PDFRO3730™ Antenna Grade Laminates Data SheetEnglish106 KB
PDFRO4000® High Frequency Laminate with TICER FoilEnglish31 KB
PDFRO4000® Laminates - Data sheet English271 KB
PDFRO4000® LoPro™ LaminatesEnglish187 KB
PDFRO4360G2™ High Frequency Laminates Data SheetEnglish89 KB
PDFRO4400™ Series Prepreg Data Sheet: RO4450B™ and RO4450F™ Prepregs English131 KB
PDFRO4500™ Antenna Grade Laminates for High Volume ApplicationsEnglish82 KB
PDFRO4730™ LoPro™ Antenna Grade Laminate Data SheetEnglish94 KB
PDFRO4835™ Laminate Data SheetEnglish161 KB
PDFRT/duroid 5870/ 5880 Data SheetEnglish62 KB
PDFRT/duroid 5880LZ High Frequency LaminatesEnglish97 KB
PDFRT/duroid 6002 laminate data sheetEnglish101 KB
PDFRT/duroid 6006/6010LM laminate data sheet English60 KB
PDFRT/duroid 6202 laminate data sheet English59 KB
PDFRT/duroid 6202PR laminate data sheetEnglish74 KB
PDFRT/duroid® 6035HTC High Frequency LaminatesEnglish180 KB
PDFTMM® Thermoset laminate data sheet: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13iEnglish56 KB
PDFULTRALAM® 3000 LCP laminate data sheet: ULTRALAM 3850English202 KB
PDFULTRALAM® 3000 LCP Prepreg: ULTRALAM® 3908English377 KB
PDFXT/duroid® 8000 High Frequency Circuit MaterialsEnglish60 KB
PDFXT/duroid® 8100 High Frequency Circuit Materials Data SheetEnglish90 KB
PDF2929半固化片数据资料表中文2 MB
PDFRO4000系列数据资料表中文1 MB
PDFRO4400系列数据资料表中文1 MB
PDFRO4835数据资料表中文1 MB
 

Electrical Design Data

Size
PDFDesign Data for Microstrip Transmission Lines of TMM LaminatesEnglish118 KB
PDFDesign Data for Microstrip Transmission Lines on RT/duroid LaminatesEnglish112 KB
PDFDesign Equations for Broadside and Edgewise StriplineEnglish151 KB
PDFGeneral Information of Dielectric Constant for RT/duroid® 6010.2LM & RO3010™ High Frequency Circuit MaterialsEnglish96 KB
PDFHandling Continuous Power in Bonded Stripline of RT/duroid LaminatesEnglish65 KB
PDFLine Widths for Various Characteristic Impedance of Center Stripline Devices in a Variety of RT/duroid High Frequency LaminatesEnglish155 KB
PDFTemperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF CurrentEnglish30 KB
 

Fabrication Information

Size
PDF2929 Bondply Multi-Layer Board Processing GuidelinesEnglish152 KB
PDF3001 Bonding Film Properties and Laminating Techniques English38 KB
PDFAfter Etch Stress Relief in RT/duroid Microwave Laminates English23 KB
PDFBonding PTFE Materials for Microwave Stripline Packages and Other Multilayer CircuitsEnglish83 KB
PDFDevice Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency LaminatesEnglish109 KB
PDFFabrication Guidelines for RO3000® and RO3200® Series High Frequency Circuit MaterialsEnglish34 KB
PDFFabrication Guidelines: RO4400™ series prepregs. RO4450B™, RO4450F™ prepregsEnglish137 KB
PDFFabrication Guidelines: RT/duroid 6202PR High Frequency LaminatesEnglish29 KB
PDFFabrication Guidelines: RT/duroid® 5880LZ High Frequency LaminatesEnglish74 KB
PDFFabrication Guidelines: MCL-HE-679G/ THETA® Circuit Materials English102 KB
PDFFabrication Guidelines: RO3730 Antenna Grade Laminates English30 KB
PDFFabrication Guidelines: RO4000 LoPro™ laminates English155 KB
PDFFabrication Guidelines: RO4000® Series LaminatesEnglish62 KB
PDFFabrication Guidelines: RO4360G2™ High Frequency LaminatesEnglish61 KB
PDFFabrication Guidelines: RO4730™ LoPro™ Antenna Grade LaminateEnglish127 KB
PDFFabrication Guidelines: RT/duroid 5870/5880 & ULTRALAM 2000 High Frequency Circuit MaterialsEnglish44 KB
PDFFabrication Guidelines: RT/duroid 6002/6006/6010 High Frequency Circuit MaterialsEnglish114 KB
PDFFabrication Guidelines: RT/duroid 6035HTC High Frequency LaminatesEnglish31 KB
PDFFabrication Guidelines: TMM® High Frequency LaminatesEnglish232 KB
PDFFabrication Guidelines: ULTRALAM 3000 LCP MaterialsEnglish207 KB
PDFFabrication Guidelines: XT/duroid 8000 / 8100 High Frequency CIrcuit MaterialsEnglish28 KB
PDFGuidelines for Drilling RT/duroid 6002 Bonded Assemblies and Multilayer Boards English16 KB
PDFHow to Avoid Creep on Board AssembliesEnglish35 KB
PDFPTFE Safety Notes on Using RT/duroid Composite Material English18 KB
PDFQuick Reference Processing Guidelines: RO3000® and RO3200™ LaminatesEnglish21 KB
PDFQuick Reference Processing Guidelines: RO3730 Antenna Grade LaminatesEnglish21 KB
PDFQuick Reference Processing Guidelines: RO4003C/RO4350B High Frequency LaminatesEnglish25 KB
PDFQuick Reference Processing Guidelines: RO4360G2™ High Frequency LaminatesEnglish21 KB
PDFQuick Reference Processing Guidelines: RO4730™ LoPro™ Antenna Grade LaminatesEnglish24 KB
PDFQuick Reference Processing Guidelines: RT/duroid 6035HTC High Frequency LaminatesEnglish21 KB
PDFQuick Reference Processing Guidelines: RT/duroid® 5880LZ High Frequency LaminatesEnglish24 KB
PDFQuick Reference Processing Guidelines: XT/duroid 8000 /8100 High Frequency Circuit MaterialsEnglish22 KB
PDFQuick Reference Processing Guidelines:RO4000® LoPro™ Laminates English22 KB
PDFRT/duroid 6002 Microwave Laminates Direct Bonding English43 KB
PDFThe Prevention and Removal of Absorbed Chemicals in RT/duroid 6002 Microwave Laminates English24 KB
PDFThe Prevention of Extraneous Secondary Plating of RT/duroid® High Frequency Laminates English127 KB
PDF2929粘结片 多层电路板加工指南中文5 MB
PDFRO4000系列加工指南中文1 MB
PDFRO4400系列加工指南中文1 MB
 

General

Size
PDFDNV ISO 9001:2008 CertificateEnglish49 KB
PDFRoHS Certification Letter - Flexible Circuit MaterialsEnglish456 KB
PDFRoHS Certification Letter - High Frequency MaterialsEnglish36 KB
 

Product Selection Guides

Size
PDFHigh Frequency Laminates - Product Selector Guide and Standard Thicknesses and TolerancesEnglish643 KB
PDF高频产品选材指南中文1 MB
 

Properties - Detailed Characteristics

Size
PDFA Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid 5870 Material English110 KB
PDFCopper Foils for High Frequency Circuit MaterialsEnglish672 KB
PDFGood Performance of RT/duroid Microwave Laminate in a Cryogenic Stripline Application at NASAEnglish32 KB
PDFLow Outgassing Characteristics English22 KB
PDFProperties GuideEnglish60 KB
PDFRO4003 High Frequency Material Insertion Loss Comparison with Other MaterialsEnglish264 KB
PDFRT/duroid PTFE-Based Composite Meets Flammability Requirements for Oxygen EnvironmentsEnglish30 KB
PDFThe Advantage of Nearly Isotropic Dielectric Constant of RT/duroid 5870-5880 Glass Microfiber PTFE English119 KB
PDFThe Benefits of Selecting RT/duroid 6010LM for Band Pass FiltersEnglish417 KB
PDFThe Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear RadiationEnglish93 KB
 

Sell Sheet

Size
PDFPCB Materials for Handheld Device AntennasEnglish40 KB
 

Software Instructional Manuals

Size
PDFMicrowave Impedance Calculator 2008 Instructional ManualEnglish1 MB
PDFMicrowave Impedance Calculator 2010 Instructional ManualEnglish1 MB
PDFMicrowave Impedance Calculator 2013 Instructional ManualEnglish979 KB
 

Technical Articles

Size
PDFRogers RT/duroid® Material Provides Flexible Substrates in New Conical Antenna English211 KB
PDFThick Metal Cladding on High Frequency LaminatesEnglish84 KB