Data Sheets | Size |
 | 2929 Bondply Data Sheet | English | 90 KB |
| 3001 Bonding Film Properties and Laminating Techniques | English | 212 KB |
| MCL-HE-679G/ THETA® Circuit Materials Data Sheet | English | 224 KB |
| RO3000 Series Bondply - Data Sheet & Processing Guidelines | English | 60 KB |
| RO3000® Laminate Data Sheet: RO3003™, RO3006™, RO3010™ | English | 229 KB |
| RO3035™ Laminate Data Sheet | English | 60 KB |
| RO3200™ Laminate Data Sheet: RO3203™, RO3206™, RO3210™ | English | 103 KB |
| RO3730™ Antenna Grade Laminates Data Sheet | English | 106 KB |
| RO4000® High Frequency Laminate with TICER Foil | English | 31 KB |
| RO4000® Laminates - Data sheet | English | 271 KB |
| RO4000® LoPro™ Laminates | English | 187 KB |
| RO4360G2™ High Frequency Laminates Data Sheet | English | 89 KB |
| RO4400™ Series Prepreg Data Sheet: RO4450B™ and RO4450F™ Prepregs | English | 131 KB |
| RO4500™ Antenna Grade Laminates for High Volume Applications | English | 82 KB |
| RO4730™ LoPro™ Antenna Grade Laminate Data Sheet | English | 94 KB |
| RO4835™ Laminate Data Sheet | English | 161 KB |
| RT/duroid 5870/ 5880 Data Sheet | English | 62 KB |
| RT/duroid 5880LZ High Frequency Laminates | English | 97 KB |
| RT/duroid 6002 laminate data sheet | English | 101 KB |
| RT/duroid 6006/6010LM laminate data sheet | English | 60 KB |
| RT/duroid 6202 laminate data sheet | English | 59 KB |
| RT/duroid 6202PR laminate data sheet | English | 74 KB |
| RT/duroid® 6035HTC High Frequency Laminates | English | 180 KB |
| TMM® Thermoset laminate data sheet: TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i | English | 56 KB |
| ULTRALAM® 3000 LCP laminate data sheet: ULTRALAM 3850 | English | 202 KB |
| ULTRALAM® 3000 LCP Prepreg: ULTRALAM® 3908 | English | 377 KB |
| XT/duroid® 8000 High Frequency Circuit Materials | English | 60 KB |
| XT/duroid® 8100 High Frequency Circuit Materials Data Sheet | English | 90 KB |
| 2929半固化片数据资料表 | 中文 | 2 MB |
| RO4000系列数据资料表 | 中文 | 1 MB |
| RO4400系列数据资料表 | 中文 | 1 MB |
| RO4835数据资料表 | 中文 | 1 MB |
| |
Electrical Design Data | Size |
| Design Data for Microstrip Transmission Lines of TMM Laminates | English | 118 KB |
| Design Data for Microstrip Transmission Lines on RT/duroid Laminates | English | 112 KB |
| Design Equations for Broadside and Edgewise Stripline | English | 151 KB |
| General Information of Dielectric Constant for RT/duroid® 6010.2LM & RO3010™ High Frequency Circuit Materials | English | 96 KB |
| Handling Continuous Power in Bonded Stripline of RT/duroid Laminates | English | 65 KB |
| Line Widths for Various Characteristic Impedance of Center Stripline Devices in a Variety of RT/duroid High Frequency Laminates | English | 155 KB |
| Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current | English | 30 KB |
| |
Fabrication Information | Size |
| 2929 Bondply Multi-Layer Board Processing Guidelines | English | 152 KB |
| 3001 Bonding Film Properties and Laminating Techniques | English | 38 KB |
| After Etch Stress Relief in RT/duroid Microwave Laminates | English | 23 KB |
| Bonding PTFE Materials for Microwave Stripline Packages and Other Multilayer Circuits | English | 83 KB |
| Device Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency Laminates | English | 109 KB |
| Fabrication Guidelines for RO3000® and RO3200® Series High Frequency Circuit Materials | English | 34 KB |
| Fabrication Guidelines: RO4400™ series prepregs. RO4450B™, RO4450F™ prepregs | English | 137 KB |
| Fabrication Guidelines: RT/duroid 6202PR High Frequency Laminates | English | 29 KB |
| Fabrication Guidelines: RT/duroid® 5880LZ High Frequency Laminates | English | 74 KB |
| Fabrication Guidelines: MCL-HE-679G/ THETA® Circuit Materials | English | 102 KB |
| Fabrication Guidelines: RO3730 Antenna Grade Laminates | English | 30 KB |
| Fabrication Guidelines: RO4000 LoPro™ laminates | English | 155 KB |
| Fabrication Guidelines: RO4000® Series Laminates | English | 62 KB |
| Fabrication Guidelines: RO4360G2™ High Frequency Laminates | English | 61 KB |
| Fabrication Guidelines: RO4730™ LoPro™ Antenna Grade Laminate | English | 127 KB |
| Fabrication Guidelines: RT/duroid 5870/5880 & ULTRALAM 2000 High Frequency Circuit Materials | English | 44 KB |
| Fabrication Guidelines: RT/duroid 6002/6006/6010 High Frequency Circuit Materials | English | 114 KB |
| Fabrication Guidelines: RT/duroid 6035HTC High Frequency Laminates | English | 31 KB |
| Fabrication Guidelines: TMM® High Frequency Laminates | English | 232 KB |
| Fabrication Guidelines: ULTRALAM 3000 LCP Materials | English | 207 KB |
| Fabrication Guidelines: XT/duroid 8000 / 8100 High Frequency CIrcuit Materials | English | 28 KB |
| Guidelines for Drilling RT/duroid 6002 Bonded Assemblies and Multilayer Boards | English | 16 KB |
| How to Avoid Creep on Board Assemblies | English | 35 KB |
| PTFE Safety Notes on Using RT/duroid Composite Material | English | 18 KB |
| Quick Reference Processing Guidelines: RO3000® and RO3200™ Laminates | English | 21 KB |
| Quick Reference Processing Guidelines: RO3730 Antenna Grade Laminates | English | 21 KB |
| Quick Reference Processing Guidelines: RO4003C/RO4350B High Frequency Laminates | English | 25 KB |
| Quick Reference Processing Guidelines: RO4360G2™ High Frequency Laminates | English | 21 KB |
| Quick Reference Processing Guidelines: RO4730™ LoPro™ Antenna Grade Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: RT/duroid 6035HTC High Frequency Laminates | English | 21 KB |
| Quick Reference Processing Guidelines: RT/duroid® 5880LZ High Frequency Laminates | English | 24 KB |
| Quick Reference Processing Guidelines: XT/duroid 8000 /8100 High Frequency Circuit Materials | English | 22 KB |
| Quick Reference Processing Guidelines:RO4000® LoPro™ Laminates | English | 22 KB |
| RT/duroid 6002 Microwave Laminates Direct Bonding | English | 43 KB |
| The Prevention and Removal of Absorbed Chemicals in RT/duroid 6002 Microwave Laminates | English | 24 KB |
| The Prevention of Extraneous Secondary Plating of RT/duroid® High Frequency Laminates | English | 127 KB |
| 2929粘结片 多层电路板加工指南 | 中文 | 5 MB |
| RO4000系列加工指南 | 中文 | 1 MB |
| RO4400系列加工指南 | 中文 | 1 MB |
| |
General | Size |
| DNV ISO 9001:2008 Certificate | English | 49 KB |
| RoHS Certification Letter - Flexible Circuit Materials | English | 456 KB |
| RoHS Certification Letter - High Frequency Materials | English | 36 KB |
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Product Selection Guides | Size |
| High Frequency Laminates - Product Selector Guide and Standard Thicknesses and Tolerances | English | 643 KB |
| 高频产品选材指南 | 中文 | 1 MB |
| |
Properties - Detailed Characteristics | Size |
| A Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid 5870 Material | English | 110 KB |
| Copper Foils for High Frequency Circuit Materials | English | 672 KB |
| Good Performance of RT/duroid Microwave Laminate in a Cryogenic Stripline Application at NASA | English | 32 KB |
| Low Outgassing Characteristics | English | 22 KB |
| Properties Guide | English | 60 KB |
| RO4003 High Frequency Material Insertion Loss Comparison with Other Materials | English | 264 KB |
| RT/duroid PTFE-Based Composite Meets Flammability Requirements for Oxygen Environments | English | 30 KB |
| The Advantage of Nearly Isotropic Dielectric Constant of RT/duroid 5870-5880 Glass Microfiber PTFE | English | 119 KB |
| The Benefits of Selecting RT/duroid 6010LM for Band Pass Filters | English | 417 KB |
| The Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear Radiation | English | 93 KB |
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Sell Sheet | Size |
| PCB Materials for Handheld Device Antennas | English | 40 KB |
| |
Software Instructional Manuals | Size |
| Microwave Impedance Calculator 2008 Instructional Manual | English | 1 MB |
| Microwave Impedance Calculator 2010 Instructional Manual | English | 1 MB |
| Microwave Impedance Calculator 2013 Instructional Manual | English | 979 KB |
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Technical Articles | Size |
| Rogers RT/duroid® Material Provides Flexible Substrates in New Conical Antenna | English | 211 KB |
| Thick Metal Cladding on High Frequency Laminates | English | 84 KB |