High Speed Digital

As network speeds increase, so does the need for high performance materials. Rogers offers a solution for your high-speed digital design applications including Internet infrastructure, servers, switches, network storage and automatic test equipment.

Rogers RO4000® high frequency circuit materials offer low dielectric constant and low insertion loss, delivering superior electrical performance in high data rate transmission systems. This enables designers to reduce overall board thickness and increase circuit trace and space density. These materials have excellent dielectric constant and thickness control for sensitive controlled impedance applications. RO4000 is a thermoset material suited for high volume fabrication and assembly. Low z-axis CTE provides excellent plated through-hole reliability. High Tg and Td along with high thermal conductivity allow RO4000 materials to be used in a wide variety of operating environments and process conditions. RO4000 laminate is UL 94V-O and comes in several versions of prepregs, for a truly homogenous materials system.

	Theta™ Circuit Materials Theta™ circuit materials are halogen free and have good dielectric characteristics suitable for high frequency signals, and superior heat resistance for high layer count boards. They are suitable for network applications (router, server), and high frequency devices.

	RO4000® Series High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset) Some Typical Applications: high speed backplanes and line cards, device under test (DUT) boards and pin cards for automated test equipment, high layer count multilayer boards, hybrid multilayer boards.

	ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials Some Typical Applications: high speed connector cables, chip carrier substrate, rigid flex, mobile communication systems, microwave test equipment.