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3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)
Rogers 3001 bonding film features a low dielectric constant and low loss tangent at microwave frequencies, ensuring minimum interference with the electrical function of bonded stripline and other multilayer constructions. This advanced circuit material is compatible with Rogers' RT/duroid® low dielectric constant laminates, ULTRALAM® woven glass/PTFE microwave circuit laminates, RO3000® series high frequency circuit materials, RT/duroid® 6002 ceramic filled circuit materials, and other PTFE-based low dielectric constant substrates.
Product Features
- Low dielectric constant and low loss tangent at microwave frequencies
- Minimal interference with electrical function of bonded stripline and other multilayer circuits
- Low outgassing
- RoHS compliant, environment friendly