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ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials

With a dielectric constant of 2.9, a low loss tangent and very low moisture absorption (<0.04% by weight), Rogers ULTRALAM® 3000 LCP laminates are suited for high frequency microminaturization applications, sensors, antennas and high speed flip-chip designs.

Our ULTRALAM® 3850 advanced circuit material is a thin double-clad copper laminate, incorporating chemical and temperature resistant liquid crystalline polymer as a dielectric film. This high frequency laminate is characterized by low and stable dielectric constant and dielectric loss, which are key requirements for high frequency, high-speed products. It can be used for multilayer constructions with ULTRALAM® 3908 bonding film.

Product Features:

• Excellent high frequency properties
  • Stable electrical properties for tightly controlled impedance matching
  • Excellent thickness uniformity for maximum signal integrity
  • Allows for thinner dielectric layer with minimal signal distortion
• Good dimensional stability - low modulus
  • Bends easily for flex and conformal applications
  • Offers design flexibility and maximizes circuit density requirements
• Extremely low moisture absorption
  • Reduces bake times
  • Maintains stable electrical, mechanical and dimensional properties in humid environments
• Flame resistant
  • Halogen-free. RoHS and WEEE compliant
  • UL94VTM/0 - meets flammability requirement for consumer products

Data Sheets			Size
	ULTRALAM® 3000 LCP laminate data sheet: ULTRALAM 3850	English	121 KB
	ULTRALAM® 3000 LCP Prepreg: ULTRALAM® 3908	English	377 KB
Fabrication Information			Size
	Fabrication Guidelines: ULTRALAM 3000 LCP Materials	English	94 KB
General			Size
	Advanced Packaging: Organically Grown Wireless SiP Solutions	English	480 KB
	DNV ISO 9001:2008 Certificate	English	122 KB
	RoHS Certification Letter - High Frequency Materials	English	36 KB
Product Selection Guides			Size
	High Frequency Laminates - Product Selector Guide	English	97 KB
Properties - Detailed Characteristics			Size
	Copper Foils for High Frequency Circuit Materials	English	494 KB
	Properties Guide	English	60 KB