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Home >> Advanced Circuit Materials >> Products >> High Frequency Laminates >> RO2808™ Fluoropolymer Composite Circuit Laminates for Advanced Packaging Applications
RO2808™ circuit laminates are fluoropolymer composite printed wiring board (PWB) materials specially designed for the advanced packaging applications.
The combination of high dielectric constant and thin dielectric thickness of RO2808 products offers excellent electrical performance - high capacitance per unit area - which could significantly increase the density of the integrated components and reduce the package module footprint.
The low dissipation factor, along with the low profile copper thickness option, offers low electrical loss and high Q factor for signal propagation, and narrow line width and spacing in high I/O count configurations. In addition, the ceramic filler system improves the circuit laminate’s dimensional stability, surface finish, and laser processing compared with woven glass reinforced products. A low modulus and X,Y-directions coefficient of thermal expansion afford reliable surface mounting of high I/O leadless ceramic chip carriers.
Contact us for product sampling. Consult your Rogers' Technical Service Engineer for fabrication guidelines.