RO4000® LoPro™ Laminates

RO4000® Laminates

RO4000® LoPro™ laminates use a proprietary Rogers’ technology that allows reverse treated foil to bond to standard RO4000 dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4000 laminate system.

RO4000 hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and do not require specialized via preparation such as sodium etch for lower manufacturing cost.

The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above. Low dielectric loss allows RO4000 series material to be used in many applications where higher operating frequencies limit the use of conventional circuit board laminates. The temperature coefficient of dielectric constant is among the lowest of any circuit board material and the dielectric constant is stable over a broad frequency range. This makes it an ideal substrate for broadband applications.

Benefits

  • Lower insertion loss for higher operating frequency designs (even greater than 40 GHz) 
  • Reduced passive intermodulation (PIM) for base station antennas
  • Improved thermal performance due to lower conductor loss

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • RF Identification (RFID) Tags
  • LNB’s for Direct Broadcast Satellites

Samples

Samples can be requested through our online request system.

Data Sheets

Size
PDFRO4000® Laminates - Data sheet English271 KB
PDFRO4000系列 数据资料表中文1 MB
PDFRO4000® LoPro™ LaminatesEnglish187 KB
 

Electrical Design Data

Size
PDFTemperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF CurrentEnglish30 KB
 

Fabrication Information

Size
PDFDevice Attachment Methods and Wirebonding Notes for RT/duroid and RO4000 Series High Frequency LaminatesEnglish109 KB
PDFFabrication Guidelines: RO4000 LoPro™ laminates English155 KB
PDFRO4000系列加工指南中文1 MB
PDFQuick Reference Processing Guidelines: RO4000® LoPro™ Laminates English22 KB
 

General

Size
PDFDNV ISO 9001:2008 CertificateEnglish79 KB
 

Product Selection Guides

Size
PDFHigh Frequency Laminates - Product Selector Guide and Standard Thicknesses and Tolerances

The Product Selector Guide is also available online in an interactive version. To view this online version please follow the link below.

View Online Version Online Interactive Product Selector Guide

English15 MB
PDFHigh Frequency Laminates - Product Selector Guide and Standard Thicknesses and Tolerances (low resolution copy)English797 KB
 

Properties - Detailed Characteristics

Size
PDFCopper Foils for High Frequency Circuit MaterialsEnglish672 KB
PDFLow Outgassing Characteristics English22 KB
PDFProperties GuideEnglish60 KB