High Frequency Laminates

Extensive selection of unique, advanced high frequency laminates engineered to meet a wide range of applications, including:

range of dielectric constants
low dissipation factor
temperature stability
strong mechanical and thermal properties
low-cost products for commercial applications

Rogers Superior Performance

We are determined to provide our customers with high frequency laminates that are:

exceptionally reliable
technologically superior
tailored to match for your specific application needs

Rogers Sales, technical service, customer service – around the world

Contact our expert sales, technical service and customer service personnel in North and South America, Europe and Asia.

Rogers High Frequency Laminates: Product Lines

Our technical experts will collaborate with yours on product design and selection of the specific Rogers high frequency laminate products that best meet your needs. These brief descriptions provide general guidelines regarding applications and environments for each product line.

	RO2808™ Fluoropolymer Composite Circuit Laminates for Advanced Packaging Applications RO2808™ circuit laminates are fluoropolymer composite printed wiring board (PWB) materials specially designed for the advanced packaging applications. The combination of high dielectric constant and thin dielectric thickness of RO2808 products offers excellent electrical performance - high capacitance per unit area - which could significantly increase the density of the integrated components and reduce the package module footprint.
	SYRON™ 7000 High Performance Circuit Material SYRON™ 7000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. Applications for this material would include high temperature and harsh environment printed circuit boards; sensors located in engine, gearbox and braking systems; tire pressure sensors.
	Theta™ Circuit Materials Theta™ circuit materials are halogen free and have good dielectric characteristics suitable for high frequency signals, and superior heat resistance for high layer count boards. They are suitable for network applications (router, server), and high-speed digital applications.
	XT/duroid™ 8000 High Performance Circuit Materials XT/duroid™ 8000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. Applications for this material would include lightweight antennas, manifolds and feed networks, thin microstrip circuits. Also ideal for lightning strike protection, and integrating foils or circuits into the structural sections of aircraft fuselages.
	3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer) Recommended for bonding low dielectric constant PTFE microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.
	RO3000®, RO3200™series and RO3730™ High Frequency Laminates (PTFE/Ceramic) High frequency circuit materials used in commercial microwave and RF applications. They offer exceptional electrical and mechanical stability at competitive prices. Introducing RO3730™ antenna grade laminates - our newest antenna material for high volume applications.
	RO4000® Series High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset) Laminates and prepregs designed to offer superior high frequency performance and low cost circuit fabrication. The result is low loss materials that can be fabricated using standard epoxy/glass (FR4) processes offered at a competitive price. RO4360™ high frequency material offers the same repeatability and reliability as our RO4000 materials with the added benefit of a higher DK of 6.15 for reduced circuit dimensions. RO4500™and RO4730™ LoPro™ antenna grade laminates extend the RO4000 product series into large volume antenna applications. The ceramic filled, glass reinforced, hydrocarbon based material provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. LoPro™ Reverse-Treated Copper Foil Option is now available for RO4000® series laminates! This special interface technology works with RO4000 materials for improved insertion loss and outstanding passive intermodulation characteristics.
	RT/duroid® 5870/5880/5880LZ High Frequency Laminates These materials are designed for exacting stripline and microstrip circuit applications.
	RT/duroid® 6002, 6202, 6006, 6010 PTFE/Ceramic Laminates Offered in four grades. RT/duroid® 6002, 6202, 6006 and 6010 laminates are ceramic-PTFE composites offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
	TMM® Thermoset Microwave Laminates (Thermoset ceramic loaded plastic) Designed for high reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.
	ULTRALAM® 2000 Woven Glass PTFE Laminates Microwave laminates designed for high reliability stripline and microstrip circuit applications.
	ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials A double-clad copper laminate, with the temperature resistant liquid crystalline polymer as a dielectric film.