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Advanced Circuit Materials
Extensive selection of unique, advanced high frequency laminates and circuit materials engineered to meet a wide range of applications, including:
- range of dielectric constants
- low dissipation factor
- temperature stability
- strong mechanical and thermal properties
- low-cost products for commercial applications
Rogers Superior Performance
We are determined to provide our customers with high frequency laminates and circuit materials that are:
- exceptionally reliable
- technologically superior
- tailored to match for your specific application needs
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Contact our expert sales, technical service and customer service personnel in North and South America, Europe and Asia.
Rogers High Frequency Materials: Product Lines
Our technical experts will collaborate with yours on product design and selection of the specific Rogers high frequency laminate products that best meet your needs. These brief descriptions provide general guidelines regarding applications and environments for each product line.
 | SYRON™ 7000 / 7100 High Performance Circuit Material
SYRON™ 7000 and SYRON 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. Applications for this material would include high temperature and harsh environment printed circuit boards; sensors located in engine, gearbox and braking systems; tire pressure sensors.
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| Theta™ Circuit Materials
Theta™ circuit materials are halogen free and have good dielectric characteristics suitable for high frequency signals, and superior heat resistance for high layer count boards. They are suitable for network applications (router, server), and high-speed digital applications.
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| XT/duroid™ 8000 / 8100 High Frequency Circuit Materials
XT/duroid™ 8000 and XT/duroid 8100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. Applications for this material would include lightweight antennas, manifolds and feed networks, thin microstrip circuits. Also ideal for lightning strike protection, and integrating foils or circuits into the structural sections of aircraft fuselages.
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| 3001 Bonding Film (Thermoplastic Chloro-fluorocopolymer)
Recommended for bonding low dielectric constant PTFE microwave stripline packages and other multilayer circuits. It may also be used to bond other structural and electrical components to the dielectric.
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| RO3000®, RO3200™series and RO3730™ High Frequency Laminates (PTFE/Ceramic)
High frequency circuit materials used in commercial microwave and RF applications. They offer exceptional electrical and mechanical stability at competitive prices.
Introducing RO3730™ antenna grade laminates - our newest antenna material for high volume applications.
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| RO4000® Series High Frequency Circuit Materials (Woven glass reinforced, ceramic filled thermoset)
Laminates and prepregs designed to offer superior high frequency performance and low cost circuit fabrication. The result is low loss materials that can be fabricated using standard epoxy/glass (FR4) processes offered at a competitive price.
RO4450B™ and RO4450F prepregs were developed to enable users to build high frequency multilayers and are based upon the RO4000 series core materials. RO4450B and RO4450F prepregs are compatible in multilayer constructions with either RO4003C™, or RO4350B™ laminate. RO4000 series high frequency prepregs are compatible with the majority of standard FR4 processing practices.
RO4500™and RO4730™ LoPro™ antenna grade laminates extend the RO4000 product series into large volume antenna applications. The ceramic filled, glass reinforced, hydrocarbon based material provides the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
LoPro™ Reverse-Treated Copper Foil Option is now available for RO4000® series laminates! This special interface technology works with RO4000 materials for improved insertion loss and outstanding passive intermodulation characteristics.
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| RT/duroid® 5870/5880/5880LZ High Frequency Laminates
These materials are designed for exacting stripline and microstrip circuit applications.
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| RT/duroid® 6002, 6202, 6006, 6010 PTFE/Ceramic Laminates
Offered in four grades. RT/duroid® 6002, 6202, 6006 and 6010 laminates are ceramic-PTFE composites offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
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| RT/duroid® 6035HTC High Frequency Laminates
RT/duroid® 6035HTC high frequency materials are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
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| TMM® Thermoset Microwave Laminates (Thermoset ceramic loaded plastic)
Designed for high reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.
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| ULTRALAM® 3000 Series Liquid Crystalline Polymer Circuit Materials
A double-clad copper laminate, with the temperature resistant liquid crystalline polymer as a dielectric film.
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