When reliability, efficiency and performance are critical, design engineers partner with Rogers to develop and deliver the material technologies they require.
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Leading High-Frequency Circuit Material Solutions
Trusted Sealing, Impact Protection and Vibration Isolation Solutions
High Performance Thermal Management and Energy Efficient Solutions
Molded components for level sensing, document handling, sealing; Integrated circuits (ICs) for electro-luminescent (EL) lighting
Home >> Advanced Connectivity Solutions >> Applications >> Communications Systems
RF subsystems used in communications systems include, power amplifiers, low noise amplifiers and digital communications control circuitry.
Rogers has long been the industry leader in providing materials for RF & microwave power amplifiers. Literally millions of PA’s designed on Rogers’ laminates have been operating in the field reliably year after year. Low loss, high
thermal conductivity, stability over temperature and excellent long term aging characteristics under heat provide the efficiency and maximum power output possible.
LNA’s need to operate efficiently in many environmental conditions. Our low loss thermally stable materials help to achieve optimal performance in demanding military environments.
Our extremely low loss materials support faster switching, higher data rates and lower crosstalk. Low dielectric constant, low loss
tangent composites and low conductor loss rolled copper enable technology performance up to 100 Gbps. Rogers ACS composites are designed for skew reduction through the use of both flat glass and relatively lower fiberglass content.
2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.
chloro-trifluoroethylene (CTFE) thermoplastic copolymer.