When reliability, efficiency and performance are critical, design engineers partner with Rogers to develop and deliver the material technologies they require.
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Leading High-Frequency Circuit Material Solutions
Trusted Sealing, Impact Protection and Vibration Isolation Solutions
High Performance Thermal Management and Energy Efficient Solutions
Molded components for level sensing, document handling, sealing; Integrated circuits (ICs) for electro-luminescent (EL) lighting
Home >> Advanced Connectivity Solutions >> Applications >> IP Infrastructure
As the consumer demand for faster and more data drives channel speeds of service provider IP infrastructure beyond 25 Gbps, one of the limiting factors in increasing network performance is the signal attenuation resulting from the circuit materials used in the
Rogers circuit materials offer low insertion loss and low dielectric constants combined with superior thermal/mechanical performance for the most demanding high layer count applications.
ULTRALAM® 3850HT laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.
2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.