When reliability, efficiency and performance are critical, design engineers partner with Rogers to develop and deliver the material technologies they require.
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Leading High-Frequency Circuit Material Solutions
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Molded components for level sensing, document handling, sealing; Integrated circuits (ICs) for electro-luminescent (EL) lighting
Home >> Advanced Connectivity Solutions >> Applications >> Computing
As network infrastructure speeds continue to increase, the sharing computing resources on the cloud is displacing local servers or personal devices to handle processor intensive applications.In cloud computing, along with fabric computing, different services such as servers, storage and applications are delivered to an organization's computers and devices through the Internet.
Rogers high speed low loss circuit materials enable system designers the flexibility to design leading edge computing systems that maximize data throughput and minimize latency in performance demanding applications.
ULTRALAM® 3850HT laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.
2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.