When reliability, efficiency and performance are critical, design engineers partner with Rogers to develop and deliver the material technologies they require.
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Leading High-Frequency Circuit Material Solutions
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Molded components for level sensing, document handling, sealing; Integrated circuits (ICs) for electro-luminescent (EL) lighting
Home >> Advanced Connectivity Solutions >> Applications >> Test and Measurement
Automated test equipment (ATE) are complicated systems that contain many integrated test instruments for performing tests on devices, referred to as the device under test (DUT).
Automated to quickly perform measurements and evaluate the test results, an ATE is capable of testing and diagnosing faults in sophisticated wafer level or packaged electronic parts, including system on chip sand integrated circuits.
Rogers circuit materials offer low insertion loss and controlled dielectric constants that enable ATE system and DUT interface card
designers the flexibility to perform quick and accurate testing of the most sophisticated electronic components.
ULTRALAM® 3850HT laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.
2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for use in high performance, high reliability multi-layer constructions.