RO4835T™ Laminates

RO4835T™ 2.5 mil, 3 mil and 4 mil laminates are 3.3 Dk low loss, spread glass reinforced, ceramic thermoset materials that were designed as inner-layers for use in multilayer board designs, and to complement RO4835™ laminates when thinner cores are needed.

RO4835T laminates offer the same resistance to oxidation as RO4835 laminates, are low loss, have excellent Dk tolerance, and a tight thickness control for outstanding, repeatable wireless performance. They feature high performance material attributes that provide the optimum blend of price, performance and durability, and can be fabricated using standard epoxy/glass (FR-4) processes.

Features

• Glass reinforced hydrocarbon thermoset platform
• Spread glass
• Multiple thin thickness offerings
• Low z-axis CTE
• Flame retardant laminate

Benefits

• Ease of PCB manufacturing and assembly in line with FR-4
• Minimizes local variation of dielectric constant
• Improved MLB design flexibility
• Improved design flexibility, PTH reliability, and automated assembly compatible
• UL 94 V-0

Typical Applications

• Point-to-Point Microwave
• Power Amplifiers
• Cellular Infrastructure Antennas
• Phased-Array Radar
• RF Components
• Test and Measurement

Data Sheets

• RO4400™ Series Bondply Data Sheet: RO4450F™, RO4450T™ and RO4460G2™ Bondply (English; 473 KB)
• CU4000 and CU4000 LoPro Datasheet (English; 169 KB)
• RO4835T Laminate Data Sheet (English; 87 KB)
• RO4835T™ 层压板数据资料表 (中文; 564 KB)

Fabrication Information

• Fabrication Guidelines: RO4835T Core/RO4450T Bonding Layers Multi-layer Board Procesing Guidelines (English; 79 KB)
• RO4835T™芯板 RO4450T™粘结片多层板加工指南 (中文; 559 KB)