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Home >> Advanced Connectivity Solutions >> Products >> RO4000® Laminates >> RO4360G2™ Laminates
RO4360G2™ laminates are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled thermoset materials that provide the ideal balance of performance and processing capability. RO4360G2 is lead-free process capable and offers better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs.
RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can be paired with RO4400™ series prepreg and lower-Dk RO4000® laminate in multi-layer designs.
RO4360G2 laminates allow designers to reduce circuit dimensions in applications where size and cost are critical.
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