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Home >> Advanced Connectivity Solutions >> Products >> XT/duroid® Copper Clad Laminates >> XT/duroid® 8000/8100 Laminates
XT/duroid® 8000 and XT/duroid 8100 thermoplastic laminates provide an excellent solution for printed circuit board applications used in demanding environmental conditions.
These laminates are excellent for high frequency/high speed applications. Both dielectric constant and dissipation factor are stable over a wide range of frequencies.
XT/duroid 8000 and XT/duroid 8100 laminates are thermally stable, with a melt temperature higher than PTFE materials and an estimated relative thermal index (RTI) greater than 210°C (410°F). The XT/duroid products possess impressive chemical and radiation resistance. These lead-free solder capable laminates are green materials which are naturally flame retardant and halogen free.