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Home >> Advanced Connectivity Solutions >> Products >> ULTRALAM® 3000 Flexible Copper Clad Laminate and Bondply >> ULTRALAM® 3850HT Laminates
ULTRALAM® 3850HT laminates utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications.
ULTRALAM 3850HT circuit materials are characterized by low and stable dielectric constant and dielectric loss, which are key requirements for high frequency, high-speed products. ULTRALAM 3850HT laminates are offered as a double copper clad laminate. offered in panels.
These laminates can be used for multilayer constructions with ULTRALAM 3908 bonding film.