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Home >> Advanced Connectivity Solutions >> Products >> Thin Circuit Laminates (LCP and PEEK) >> ULTRALAM® 3850/3850HT Laminates
ULTRALAM® 3850/3850HT laminate circuit materials utilize highly temperature resistant liquid crystalline polymer (LCP) as the dielectric film. Developed specifically for single layer and multilayer substrate constructions, these adhesiveless laminates are well suited for high speed and high frequency applications in:
ULTRALAM 3850/3850HT circuit materials are characterized by low and stable dielectric constant and dielectric loss, which are key requirements for high frequency, high-speed products. ULTRALAM 3850/3850HT is offered as a double copper clad laminate. offered in panels.
It can be used, for multilayer constructions with ULTRALAM 3908 bonding film.