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Home >> Advanced Connectivity Solutions >> Products >> DiClad® Series Laminates >> DiClad® 870/880 Laminates
DiClad® 870 and DiClad 880 laminates were developed to offer lower dielectric constant than the original GT/GX laminates. This is achieved by using fewer plies of woven fiberglass reinforced than DiClad 522 and DiClad 527 for the same dielectric thickness laminate. This provides a composite which achieves dielectric constant and loss tangent values among the lowest available. Building blocks for DiClad are built in high volume to support a variety of applications in microwave printed circuit boards designed for broadband telecom and high frequency applications.