DiClad® 870/880 Laminates

DiClad® 870 and DiClad 880 laminates were developed to offer lower dielectric constant than the original GT/GX laminates. This is achieved by using fewer plies of woven fiberglass reinforced than DiClad 522 and DiClad 527 for the same dielectric thickness laminate. This provides a composite which achieves dielectric constant and loss tangent values among the lowest available. Building blocks for DiClad are built in high volume to support a variety of applications in microwave printed circuit boards designed for broadband telecom and high frequency applications.

Features

• Primary Dielectric Constant Targets at 2.17, 2.20 (DiClad 880) and 2.33 (DiClad 870)
• Low Dissipation Factor (Loss Tangent from 0.0009 to 0.0012 at X-band)
• Lowest Moisture Absorption Among PTFE Based Composites
• Stable Dk Over a Wide Frequency Range
• Available up to 48” x 54” Panels

Benefits

• Low Dk Supports Wider Line Widths for Lower Insertion Loss (Wide Variety of Design Requirements)
• Low Insertion Loss
• Negligible Performance Drift Caused by High Humidity Environments
• Modeled Designs Translate Quickly and Accurately to Production Results
• Maximizes Flexibility in Design and Processing

Typical Applications

• Airborne, Ground and Naval Surface Based RADAR Systems
• Automotive: Dedicated Short Range Communications
• Commercial and Defense Communication Systems
• Base Station Antennas, Low Noise Amplifiers, Lumped Element Filter Designs (Now Available with IM Series™ Cladding for Extremely Low PIM Antenna Applications)
• Radome and Frequency Selective Surfaces

Data Sheets

• DiClad® Series Data Sheet (English; 330 KB)
• IM Series™ Antenna Grade Laminates Data Sheet (English; 97 KB)

Fabrication Information

• Fabrication Guidelines: DiClad® 870/880 Laminates (English; 67 KB)
• Fabrication Guidelines: RO4835T Core/RO4450T Bonding Layers Multi-layer Board Procesing Guidelines (English; 79 KB)