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Home >> Advanced Connectivity Solutions >> Products >> XT/duroid® Copper Clad Laminates
XT/duroid laminates utilize PEEK (polyether ether ketone) based dielectric cores. XT/duroid laminates are available with or without glass reinforcement. The glass reinforcement offers improved dimensional stability and tensile strength.
XT/duroid laminates are available in multiple thicknesses starting from 2mil (50µm). These laminates can be used in flex-to-install and rigid or semi-rigid multilayer PCBs. The absence of adhesive enables thinner pure dielectric resulting in more robust performance. A selection of various copper claddings are available to meet the performance requirements of the application.
These laminates provide excellent high frequency performance when utilizing low profile copper cladding. Both the dielectric constant and dissipation factor are stable over a wide range of temperature and frequencies.
XT/duroid laminates are used in applications exposed to harsh environments. Being PEEK based, XT/duroid laminates provide stable performance in extreme temperatures (melt temperature 343C/649F) in cyclic as well as in continuous operating conditions. PEEK also offers excellent chemical and radiation resistance.
XT/duroid® 8000 and XT/duroid 8100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions.