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Home >> Advanced Connectivity Solutions >> Products >> TMM® Laminates
Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity. Due to their electrical and mechanical stability, TMM high frequency laminates are ideal for high reliability stripline and microstrip applications. When compared to alumina substrates, TMM laminates offer key fabrication advantages since it is available copper clad in larger formats, allowing the use of standard PCB subtractive processes
TMM is available in a wide range of dielectric constants ranging from 3 to 13 and available in thicknesses ranging from .015 to .500 in with a thickness tolerance of plus or minus .0015 in.