Powering Our World
Curamik Electronics solutions are at the heart of high performance, high-efficiency power electronics
The world is demanding more efficient power. Curamik substrates are found in a growing array of clean technologies that are powering the world. As our name indicates, the secret of our work is in the unique synthesis of copper and ceramics.
The DBC substrate basis is a ceramic isolator (currently aluminium oxide or aluminium nitride), to which pure copper is applied in a high-temperature melting and diffusion process, and which is then connected adhesively to the ceramics. This gives rise to the name "Direct Bonded Copper ".
In particular the great heat conductivity (up to 180 W/mK) and high heat capacity and spread of the thick copper coating (200 - 600 µm) make DBC substrates indispensable in high performance electronics.
Using the purest of copper makes for a unique current carrying capacity as compared to alternative technologies. Another reason for this is the low mechanical load of the uncased silicon chips, which have a similar thermal expansion as DBC substrates.
For about ten years, this DBC technology has been used for high performance cooling devices as well. At its heart is a channel structure made of thin copper foils, which are assembled into a hermetically tight block in the curamik bonding process. This creates a strongly enlarged copper surface, enabling efficient liquid cooling.
Particularly effective cooling is achieved by a combination of DBC substrates with a cooling channel structure, where direct contact of the uncased power chips and the water-cooled basis plate is possible.
curamik DBCs are produced in master cards of 5" x 7" or 5.5" x 7.5" for a more efficient assembly and process control compared to the production and processing of serial parts as it used to be 15 years ago.
Micro channel structures made of thin copper foils that are bonded to a hermetically tight block during the curamik bonding process build the heart of our DBC coolers. The specific micro channel structure determines the thermal resistance, pressure loss and flow rate.