Micro channel structures made of thin copper foils that are bonded to a hermetically tight block during the curamik bonding process build the heart of our DBC coolers. The specific micro channel structure determines the thermal resistance, pressure loss and flow rate. The coolant is usually led in and drained through openings at the bottom with interference fits over o-rings or screw fittings.
Liquid coolers are an ideal solution for high-power applications. The switching layout on the cooling area can be customised.
- Four times more efficient cooling than traditional module structures with liquid cooling
- Lower weight
- Smaller sizes
We differentiate between:
- integrated DBC coolers with bilateral AlN-DBC for high performance applications (>3 kW heat dissipation)
- integrated DBC coolers with bilateral Al2O3-DBC for standard applications (1-2 kW heat dissipation)
- non-integrated copper coolers as cost-efficient version (single DBC substrates equipped with power chips are soldered on)
Vias (front/rear of DBC through the micro channel structure) or isolated feedthroughs are feasible for isolated coolers.
|DBC Copper Cooler|
The DBC copper cooler consists of several layers of pure copper foil into which different, very fine structures are etched.
|Integrated DBC Cooler|
A DBC cooler consists of several layers of structured copper foil and a top and bottom layer made of DBC substrates (Al2O3 or AlN). The etched copper layers form the three-dimensional cooling structures.