Portable electronic devices are increasingly becoming slimmer. As a result, space between components within the device becomes more and more condensed.

This occurrence, coupled with the desire for increased performance and the mainstream use of metal as the design material of choice, makes the management of heat a substantial challenge. HeatSORB™ proprietary phase change material (patent pending) addresses thermal management issues by capturing heat - allowing a device to remain cooler by delaying temperature ramps.

The effective management of heat is also important as it relates to user experience.

Thermal issues are typically experienced by components such as:

  • SoC (System on Chip)
  • PMIC (Power Management IC)
  • Power Amplifier
  • Image Sensor
  • Display

HeatSORB material increases thermal efficiency and goes above and beyond traditional heat spreaders such as copper, graphite sheets, or heat pipes.

RoHS Documentation


Sell Sheets

Success Stories

Technical Data Sheets