• Condux Plus Foams

    Condux Plus Foams

    With intricate mobile device designs come unexpected electrical grounding and shielding challenges that require immediate solutions. Rogers can help.


  • Rogers Advanced Circuit Materials Mobile App

    ROG Mobile

    Featuring Rogers' MWI Tool

    All this at your fingertips:
    • Calculators
    • Literature
    • Technical Papers
    • Sample Requests
    • Available for Android and Apple devices.


  • Communication Antennas

    Finding The Right Circuit Materials For Communications Antennas


  • PORON® ShockPad Foam

    The trend toward thinner mobile devices drives the search for space-saving impact solutions. With up to seven times the impact protection of competitive materials, PORON ShockPad Foam is an ideal choice for your sensitive electronics.


  • PORON® Foam Tape

    PORON Foam Tape is now available in 0.25mm, 0.20mm, and 0.15mm thicknesses to accommodate even the thinnest designs.


Printed Circuit Materials

Connect your world by enabling quantum leads in high-frequency performance for wired and wireless communications circuits worldwide.

Power Electronics Solutions

Power your world with step-changes in efficiency, heat management, and reliability of power conversion modules and devices.

High Performance Foams

Protect your world with reliable cushioning, sealing, impact protection, and energy management solutions critical to product performance.

Rogers Corporation empowers breakthroughs in reliability, efficiency and performance by providing advanced materials technologies, application knowledge, global manufacturing, and design collaboration. Let us help you build a cleaner, safer, and more connected world.

Learn More About Rogers Corporation

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