- IMS 2013
Booth Number: 1459
06/04 - 06/06/2013
Seattle, WA USA
- PCIM China
06/18 - 06/20/2013
- PCB West 2013
Booth Number: 200
Santa Clara, CA USA
Wireless communications are changing today’s world in the same way the telephone changed yesterday’s world. With the possibilities for wireless technologies rapidly becoming tomorrow’s realities, a wide array of Rogers’ materials and components will continue to enable communications infrastructure designers to design next generation communications devices and high power infrastructure that will shrink the world by connecting it more closely together.
Base Transceiver Station - Antennas
Low cost PCB laminates designed to meet low intermodulation requirements.
Base Transceiver Station - Power Amplifiers and Components
High frequency laminates which provide the low loss performance, tight control of dielectric constant and high thermal conductivity for base station transceivers and power amplifiers.
Connections for Telecom and Datacom Cabinets
Flat compact laminated multilayer busbars for efficient and cool-running operation.