Communication Infrastructure

Wireless communications are changing today’s world in the same way the telephone changed yesterday’s world. With the possibilities for wireless technologies rapidly becoming tomorrow’s realities, a wide array of Rogers’ materials and components will continue to enable communications infrastructure designers to design next generation communications devices and high power infrastructure that will shrink the world by connecting it more closely together.

Base Transceiver Station - Antennas

Low cost PCB laminates designed to meet low intermodulation requirements.

Base Transceiver Station - Power Amplifiers and Components

High frequency laminates which provide the low loss performance, tight control of dielectric constant and high thermal conductivity for base station transceivers and power amplifiers.

Connections for Telecom and Datacom Cabinets

Flat compact laminated multilayer busbars for efficient and cool-running operation.

Upcoming Events

  • DesignCon 2017
    Booth Number: 421
    02/01 - 02/02/2017
    Santa Clara, CA USA
  • IPC 2017
    Booth Number: 3624
    02/14 - 02/16/2017
    San Diego, CA USA
  • IME 2017
    Booth Number: 133
    04/11 - 04/13/2017
    Beijing, China