Communication Infrastructure

Wireless communications are changing today’s world in the same way the telephone changed yesterday’s world. With the possibilities for wireless technologies rapidly becoming tomorrow’s realities, a wide array of Rogers’ materials and components will continue to enable communications infrastructure designers to design next generation communications devices and high power infrastructure that will shrink the world by connecting it more closely together.

Base Transceiver Station - Antennas

Low cost PCB laminates designed to meet low intermodulation requirements.

Base Transceiver Station - Power Amplifiers and Components

High frequency laminates which provide the low loss performance, tight control of dielectric constant and high thermal conductivity for base station transceivers and power amplifiers.

Connections for Telecom and Datacom Cabinets

Flat compact laminated multilayer busbars for efficient and cool-running operation.

Upcoming Events

  • PCB West 2019
    Booth Number: 201
    Santa Clara, CA USA
  • IME China
    10/23 - 10/25/2019
    Shanghai, China
  • TPCA
    10/23 - 10/25/2019
    Taipei, Taiwan