Semiconductor
Upcoming Events- IPC
Booth Number: 1125
04/06 - 04/08/2010
Las Vegas, NV USA - IMS 2010 IEEE MTT-S
Booth Number: 2920
05/25 - 05/27/2010
Anaheim, CA USA - DesignCon 2011
Booth Number: 711
02/01 - 02/02/2011
Santa Clara, CA USA
In a world where micro components get smaller and more complex all the time, it pays to partner with an experienced and trusted materials company like Rogers. Whether your design challenges are finer circuit geometry, dielectric thickness, thermal management or sophisticated high frequency chip packages, Rogers can provide you with high performance materials, from printed circuit materials and custom electrical components to foams and polymers, to help you achieve the perfect solution.
Chip Packaging
Our materials meet the needs of the advanced chip packaging industry. By combining lowest insertion loss with excellent thermal and mechanical performance, design engineers choose Rogers for their high-speed packaging applications. FC BGA (Flip Chip Ball Grid Array) lids and heat spreaders. Thermal Interface Materials (TIM) for electronic packaging.
Electroluminescent Lamp Backlighting
Highly integrated Electroluminescent (EL) Lamp drivers based on patented three-port (3P) topology (single ended output) with built-in EMI shielding to power electroluminescent lamps.
General Illumination Applications
High voltage LED drivers (IC chips) for powering LEDs used in residential and commercial architectural and decorating lighting and in billboard, displays, other signage.
Processing Equipment
AlSiC materials for end effectors, chucks and other components in semiconductor equipment. |