Rogers Corp. Introduces RO4730™ LOPRO™ Laminates for Lightweight, Low-Loss Antenna Designs
Release Date: 07/22/2009
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Chandler, AZ, July 22, 2009 –The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss. The specially formulated RO4730 LoPro thermoset resin system incorporates a hollow microsphere filler to achieve a low weight, light density laminate, which is approximately 30% lighter weight than woven-glass PTFE materials. RO4730 LoPro laminates have a matched dielectric constant of 3.0, providing a much lower cost solution for high frequency circuit boards used in base station and other antennas.
RO4730 LoPro laminates feature low Z-axis coefficient of thermal expansion (CTE of about 40 PPM/ºC) for design flexibility. With a temperature coefficient of dielectric constant of about 23 PPM/ºC, the laminates provide consistent circuit performance over short term temperature ranges. They feature the same high glass transition temperature (Tg) as Rogers’ other high-performance RO4000® laminates, greater than 280ºC, making them lead-free and automated assembly compatible.
RO4730 LoPro RoHS-compliant laminates are compatible with standard PCB fabrication techniques and plated-through-hole (PTH) processing. Designed for base station and other RFID antennas, the proprietary, halogen-free laminates support longer drill tool lifetimes than other filled materials, reducing fabrication costs.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, Conn., is a global technology leader in the development and manufacture of high performance specialty material products for a variety of applications in a wide range of markets including: portable communications, consumer products, communication infrastructure, ground transportation, and aerospace and defense. Most of the Company’s products are covered by trade secrets or patents. Rogers operates manufacturing facilities in Arizona, Connecticut, and Illinois in the U.S., in Gent, Belgium and in Suzhou, China. Asian sales offices are located in Japan, China, Taiwan, Korea, India and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation, in Taiwan with Chang Chun Plastics Co., Ltd. And in the U.S. with Mitsui Chemicals, Inc. The world runs better with Rogers.® www.rogerscorp.com.