Rogers to Showcase Thermal and Circuit Solutions at 2010 IEEE International Microwave Symposium
Release Date: 04/30/2010
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Chandler, Arizona, April 30,2010 - Rogers Corporation will display a selection of its materials-based solutions from two of its divisions at the upcoming 2010 IEEE International Microwave Symposium (IMS) (www.ims2010.org), scheduled for May 25-27, 2010 at the Anaheim Convention Center, Anaheim, CA.
Rogers Advanced Circuit Materials (ACM) Division and Thermal Management Solutions (TMS) Division will be in force at Booth # 2920 at the RF/microwave industry’s leading trade show to detail optimum use of their high-performance materials, including RT/duroid® 5880LZ, RT/duroid 6202PR, award-winning RO4360™ laminate, and HEATWAVE™ metal matrix composites, an innovative thermal-management solution.
Rogers’ representatives will be on hand to offer advice on the use of their RT/duroid 5880LZ, RT/duroid 6202PR, and RO4360 materials. RT/duroid 5880LZ is a PTFE-based composite with unique filler for applications requiring low-density, light-weight circuit boards. With its low loss and low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ laminates are ideal for exacting stripline and microstrip circuits, including airborne antennas
Woven-glass-reinforced RT/duroid 6202PR laminates offer superb mechanical and electrical stability in ground-based and airborne applications. They exhibit tight control of dielectric constant and thickness, and outstanding dimensional stability of 0.05 to 0.07 mils/in. for stable planar resistors, resonators, filters, and other high-frequency circuits. The proven stability and low thermal coefficient of dielectric constant of RT/duroid 6202PR laminates makes them well suited for multilayer circuits.
For designers needing commercial grade off-the-shelf materials, Rogers RO4000® laminates are a lower-cost alternative with strong RF performance. These glass-reinforced thermoset materials can be processed in automated assembly lines just like FR-4 and exhibit low loss with high thermal conductivity. The groundbreaking new RO4360 product is the first high Dk RF grade thermoset material to be offered in the industry. With a dielectric constant of 6.15 at 2.5 and 10 GHz, RO4360 laminates can be used for miniature printed antennas and other compact circuits. RO4360 laminates recently won a New Product Introduction (NPI) award as the best laminate introduced during the past year, presented by industry trade publications’ Circuits Assembly and Printed Circuit Design & Fabrication.
Rogers TMS Division will feature its HEATWAVE aluminum silicon carbide (AlSiC) metal matrix composite (MMC) thermal-management material. Supplied in a range of thermal conductivities from 170 to 230 W/mK, this light-weight material is suitable for thermal base plates, heat spreaders, semiconductor packaging and pin fin heat sinks. It is available with tightly controlled coefficient of thermal expansion (CTE) from 5 to 14 ppm/K, allowing users to minimize stress during thermal cycling in a wide range of thermal-management applications.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, CT, is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut, and Illinois), Europe (Ghent, Belgium and Bremen, Germany) and Asia (Suzhou, China and Ansan, South Korea). In Asia the company maintains sales offices in Japan, China, Taiwan, South Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation and in Taiwan with Chang Chun Plastics Co. Ltd.
The world runs better with Rogers. ® www.rogerscorp.com.