Rogers RO4360® High Frequency Thermoset Material Wins Award for Best New Laminate
Release Date: 04/29/2010
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Chandler, AZ, April 29, 2010 – Rogers Corporation’s Advanced Circuit Materials Division is a winner of the New Product Introduction (NPI) Award given out by UP Media Group’s Circuits Assembly and Printed Circuit Design & Fabrication magazines. Rogers RO4360® thermoset laminates won for the Laminates Category, one of 26 individual award categories.
The NPI Awards, which recognize leading new products introduced during the past 12 months, were presented at a special ceremony during the IPC APEX Expo™ held in Las Vegas in April. An independent panel of practicing industry engineers selected the award recipients.
Rogers RO4360 laminates are high frequency, glass reinforced, ceramic-filled thermoset materials that combine high performance with ease of processing. RO4360 laminates add a tailored high Dk material (6.15 @ 10 GHz) to the RO4000® family of laminates. The RO4360 laminate allows next generation power amplifier designers to meet size and cost reduction targets, where the laminate’s higher Dk allows for a significant reduction (20-30%)in finished circuit board size. RO4360 laminates process similar to RF-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B® material.
UL 94V-0 flame rated and fully lead-free process capable, RO4360 laminates possess excellent thermal conductivity of .8W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.
Typical applications for RO4360 are power amplifiers, LNAs, RF components (combiners/splitters), patch antennas, and as a replacement material for designs previously employing LTCC (low temperature, co-fired ceramic). RO4360 laminates are the material solution designers working on 4G and next generation defense/aerospace platforms have been looking for.
About Rogers Corporation
Rogers Corporation (NYSE:ROG), headquartered in Rogers, CT, is a global technology leader in the development and manufacture of high performance, specialty-material-based products for a variety of applications in diverse markets including: portable communications, communications infrastructure, computer and office equipment, consumer products, ground transportation, aerospace and defense. Rogers operates manufacturing facilities in the United States (Arizona, Connecticut and Illinois), Europe (Ghent, Belgium and Bremen, Germany) and Asia (Suzhou, China and Ansan, Korea). In Asia, Rogers maintains sales offices in Japan, China, Taiwan, Korea and Singapore. Rogers has joint ventures in Japan and China with INOAC Corporation and in Taiwan with Chang Chun Plastics Co., Ltd.
The world runs better with Rogers.® www.rogerscorp.com.