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RO-LINX® PowerCircuit™ Busbars
RO-LINX PowerCircuit™ busbar provides a solution for low power applications with currents greater than 100 amps. Often, designers are caught in the gap between (Power) PCB technology and standard busbar technology for low voltage (<690V) applications in Power Electronics.
This is characterized by an increasing need for higher power density, higher sensitivity for power efficiency due to higher energy costs and the need for more compact designs with 3D requirements. These new challenges must be compatible with high volume assembly processes.
PCB and standard busbars alone challenge designers with technological limitations. These can include:
PCB Limitations:
- No 3D capabilities
- Limited thermal management
- Maximum copper thickness of 400µm
- Current range up to 100Amp
Standard Busbars Limitations:
- High volume assembly processes
- Minimal copper thickness of 800µm
- Standard current range from 500Amp upward
Rogers’ Solution
Rogers Corporation’s newest addition to the RO-LINX® family, the RO-LINX PowerCircuit busbar, was developed to fill the gap between the two technologies (PCB and standard Busbars).
The RO-LINX PowerCircuit not only combines the best attributes of the two technologies:
- Excellent thermal management
- Fit high volume assembly processes
- 3D capabilities
RO-LINX PowerCircuit also fills in the gap between them:
- Copper thickness (400-800µm)
- Current range of a RO-LINX PowerCircuit: 100-500Amp