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Curamik® Electronics

The world is demanding more efficient power. curamik® ceramic substrates are found in a growing array of clean technologies that are powering the world. The basis of the substrate is a ceramic isolator to which pure copper is applied. The result is ceramic substrates with high heat conductivity and great heat capacity and heat spreading provided by the thick copper layer which create high performance specifications of our products for power electronics.

Our products are produced by DBC and also AMB technology. DBC is short for Direct Bond Copper. curamik's DBC substrates are manufactured by bonding copper foils directly to electrically insulating industrial ceramics. AMB is short for Active Metal Brazing - another form of joining metal to ceramic.

The result is customized ceramic substrates for highly efficient thermal management, providing high-performance electrical power management.

Product Lines

curamik® Ceramic Substrates

curamik® high temperature/ high voltage substrates consist of pure copper bonded to a ceramic substrate such as Al2O3 (Alumina), AlN (Aluminum Nitride), HPS (ZrO2 doped) or silicon based Si3N4 (Silicon Nitride).

curamik® Cooling Solutions

Micro channel structures made of thin copper foils that are bonded to a hermetically tight block during the curamik bonding process build the heart of our DBC coolers. The specific micro channel structure determines the thermal resistance, pressure loss and flow rate.