Power Electronic Solutions
Our advanced, customized components enable the performance and reliability of today’s growing array of Power Electronic devices. Our materials technologies are significantly increasing efficiency, managing heat, and ensuring the reliability of these critical devices used in converting raw energy into controlled and regulated power that can be used and managed.
Whether your device is used for conversion of power in vehicle propulsion systems, electric motor controls, electronic gear boxes, power supplies, insulated bipolar gate transistors (IGBT), or high voltage direct current (HVDC) systems, our materials technologies and collaborative engineering support can help ensure the quality, performance & reliability of your power electronic device.
curamik® Direct Bond Copper Substrates
Customized ceramic circuit substrates using Direct Bonded Copper (DBC) technology for optimal heat management, electrical isolation, and energy efficiency. The combination of ceramic and thick copper provides high ampacity and heat flux with low mechanical stresses resulting in long life reliability. With over 25 years of expertise in DBC, we are the trusted manufacturer and applications partner in Power Electronic circuit substrates.
RO-LINX® Laminated Busbars
Customized busbars for medium, high power, and high-temperature electronics applications where quality, reliability, low inductance, error-free wiring and low installation cost are critical. Over 40 years of experience in power distribution busbars combined with collaborative design and quality manufacturing on three continents, RO-LINX busbars are the first choice of designers for managing heat and conducting power in today’s Insulated Gate Bipolar Transistors(IGBTs) and other power modules.
Power Distribution Systems