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COOLSPAN™ Materials

COOLSPAN™ Materials

Thermal Interface Material

  • Two versions - 4 and 5.5 W/m.K - high thermal performance
  • Non-silicone polymer
  • Bondlines as thin as 2 mils and very low contact resistance for superior thermal impedance
  • Very reliable - will maintain functionality under extreme conditions


Thermal Interface Material Datasheets

Size
PDFCOOLSPAN TIM 300 DatasheetEnglish67 KB