Features

  • Available thicknesses are 1.5, 2 and 3 mil
  • Dielectric constant of 2.9
  • Dissipation factor of .003 at 10 GHz

Benefits

  • Ideal for multi-layer bonding
  • Excellent blind via fill capability
  • Reliable through sequential bonding

Downloads

Description Language File Type File Size
Data Sheet
2929 Bondply Data Sheet English
188KB
2929半固化片数据资料表 中文
806KB
Fabrication Information
2929 Bondply Multi-Layer Board Processing Guidelines English
108KB
2929粘结片多层电路板加工指南 中文
1MB
MSDS
PSIS - 2929 Bondply English
40KB
SDS - 2929 Bondply 中文
114KB

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