News Release

Rogers Corporation to Offer Efficient Cooling Solutions at SPIE Photonics West

Release Date: 01/16/2017

Eschenbach, Germany, January 16, 2017 – Rogers Corporation’s (NYSE:ROG) Power Electronics Solutions (PES) group will once again contribute to one of the world’s largest events for photonic products and technologies: the upcoming SPIE Photonics West Conference and Exhibition. The conference and exhibition is scheduled for January 28 through February 2, 2017 in San Francisco’s Moscone Center.

Photonics West ( is the world’s largest multidisciplinary gathering for lasers, photonics, and biomedical optics products and technologies, with more than 20,000 visitors expected to attend the week-long 2017 event.

Photonics West includes a scientific conference with more than 4500 technical presentations in three topic areas (biomedical optics and biophotonics, laser sources and lasers, and optoelectronic materials and devices). It also features two exhibitions: the BiOS Expo, with 200 companies showing products and services on biomedical optics, and the SPIE Photonics West 2017 Exhibition, where attendees can visit representatives from more than 1300 global suppliers of lasers and photonics. Among those, Rogers Power Electronics Solutions (PES) will be showing their innovative material solutions for enhancing the performance of lasers and photonics components and systems.

Rogers at Booth 409

Representatives from Rogers Power Electronics Solutions (PES) group (Rogers Germany GmbH) will be part of the SPIE Photonics West 2017 Exhibition, available at Booth 409 to show samples of their latest material-based products and to offer invaluable advice on how to apply those products to lasers and photonics designs for effective thermal management and extended operating lifetimes.

Among the Rogers PES products on display at Booth 409 will be its curamik® families of cooling products, such as curamik® CoolPerformance Plus. This active water-cooled laser diode cooler effectively removes the heat from high-power laser diodes in the tightest spaces, helping to enhance power efficiency and extend operating lifetimes. These curamik® CoolPerformance Plus coolers are formed of OFHC copper for excellent thermal conductivity and an integrated ceramic substrate for electrical isolation, combining for a tightly controlled coefficient of thermal expansion (CTE) of 5.0 to 6.5 ppm/K from +25 to +300°C.

In addition to curamik® CoolPerformance Plus, Rogers PES will show examples of its curamik® CoolPower and curamik® CoolEasy material-based laser and photonics cooling solutions. curamik® CoolPower and CoolPower Plus coolers are fabricated with multiple layers of pure copper for effective thermal dissipation in the smallest volumes possible. The coolers benefit from the unique curamik® bonding process to achieve hermetic multilayer structures without solder or additional adhesive layers. curamik® CoolEasy and CoolEasy Plus coolers are especially designed for conductive cooling of high-power laser diodes and laser diode bars. These copper coolers can be precisely machined and milled to meet the flatness requirements for mounting to laser diodes and avoiding potential “hotspots” in laser diode circuits.

PES Design Support Hub Resource for Engineers

Rogers PES brings its 40+ years of experience together in a handy online resource that is available 24/7. The PES Design Support Hub features complete technical information on

ROLINX® busbars and curamik® ceramic substrates, a library of technical papers on product design and problem solving, helpful videos on products and power distribution topics, and PES University training programs. Registration for access is quick and free. The Design Support Hub helps design engineers increase power, manage heat, and ensure the quality and reliability of their devices for optimal new product design (

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit