RO4360G2 laminates are the first high dielectric constant (Dk) thermoset laminate that can be processed similar to FR-4. These materials are lead-free process capable and offer better rigidity for improved processability in multi-layer board constructions, while reducing material and fabrication costs. RO4360G2 laminates can be paired with RO4400™ series prepreg and lower-Dk RO4000® laminate in multi-layer designs.


  • Dk of 6.15 +/- 0.15
  • Low dissipation factor of 0.0038 at 10 GHz
  • High thermal conductivity of 0.75 W/(m-K)
  • Low Z-axis coefficient of thermal expansion at 28 ppm/°C
  • High Tg greater than 280 °C TMA


  • Automated assembly compatible
  • Plated through-hole reliability
  • Environmentally friendly – lead free process compatible
  • Efficient supply chain and short lead times makes for cost effective material option



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