For decades, design engineers have relied on Rogers’ advanced materials to enable commercial aircraft and aerospace and defense systems, even in the harshest conditions. Today, our high reliability, high performance solutions can be found in the majority of the world’s commercial and military aircraft. Look to Rogers for high frequency circuit materials for radar and navigation systems, ceramic substrates and laminated busbars that improve performance and dissipate heat, and gasketing solutions for extreme sealing and protection.

Related Products

2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based thin film adhesive system.

3001 Bonding Film

Rogers Corporation’s 3001 bonding film is a thermoplastic chloro-fluorocopolymer.

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

AD Series® Laminates

Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.

ARLON® Silicones

Rogers Arlon® Silicone Technologies are the industry leaders in silicone elastomers.

BISCO® Silicones

The BISCO® product line is the world leader in silicone foams used for gasketing and sealing applications.

CLTE Series® Laminates

Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.

COOLSPAN® TECA Film

COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

CuClad® Series

Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.

curamik® Cooling Solutions

Rogers Corporation offers a suite of advanced liquid cooling solutions powered by the state of the art curamik® bonding process.

curamik® Metallized Ceramic Substrates

Rogers Corporation’s curamik® product suite offers best-in-class metallized ceramic substrates that lead the industry in enabling power electronic printed circuits.

DeWAL® Products

The DeWAL® product line is the industry leading manufacturer of high-performance polymer films and pressure-sensitive PTFE and UHMW tape.

DiClad® Series Laminates

Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.

Diversified Silicone Products®

Diversified Silicone Products (DSP) provides quality stock silicone products direct to customers.

IM Series™ Laminates

Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.

IsoClad® Series Laminates

IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.

MAGTREX™ Laminates

MAGTREX™ 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.

PORON® Industrial Polyurethanes

Rogers line of PORON® Industrial Polyurethanes provide durable, long-term performance in industrial applications.

RO3000® Series

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

RO4000® Series

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

RT/duroid® Laminates

RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

TMM® Laminates

Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

IWCS - Providence, RI

October 11, 2020 - October 14, 2020


ITSC - Vienna, Austria

June 10, 2020 - June 12, 2020


Booth 140

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