Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms which facilities ease of converting existing FR-4 designs where better electrical performance is needed.

Features

  • Glass reinforced hydrocarbon thermoset platform
  • Dk of 4.38 is tailored to FR-4 industry standard norms
  • Tighter Dk and thickness tolerance than FR-4
  • Low Z Axis CTE of 42 ppm/°C
  • High Tg of > 280°C TMA
  • Meets UL 94-V0 requirements

Benefits

  • Ease of PCB manufacturing and assembly in Line with FR-4
  • Design Dk enables ease of converting existing FR-4 designs needing better electrical performance
  • Consistent circuit performance
  • Improved design flexibility and plated through-hole reliability
  • Automated assembly compatible

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

Kappa™ 438
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 4.10+/-0.08
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 4.38
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.005
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -21
Volume Resistivity Mohm (Typical) 2.9x109
Surface Resistivity Mohm (Typical) 6.2x107
Water Absorption D48/50% (Typical) 0.12
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.64
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 13
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 16
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 42
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 5.8
Density gm/cm3 (Typical) 1.99
Flammability Rating UL94 V-0
Lead-Free Process Compatible Y
PIM dBc Typical

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