Rogers TC Series laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved Printed Circuit Board (PCB) thermal management for applications requiring high power RF signals. This improved performance and reliability in high power applications is the result of a low loss tangent, high thermal conductivity, low coefficient of thermal expansion and excellent temperature phase stability.
TC series materials are an excellent choice for applications sensitive to dielectric constant (Dk) changes with temperature, including power amplifiers, filters, couplers and more.
Reduced junction temperature and improved reliability
Improved bandwidth utilization and efficiency for amplifiers and antennas
Reliable for attachment to active components and for plated vias
Allows for PCB fabricator processing flexibility for optimized panel size