Product Lines

RF Solutions Laminates

RF laminates enabling better design and performance.

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

AD Series® Laminates

Rogers AD Series PTFE or woven glass based laminates are designed for use in high frequency PCB materials.

CLTE Series® Laminates

Rogers Corporation’s CLTE Series® products are PTFE, woven-glass, microdispersed ceramic composite laminates with low CTE values ideal for high reliability.

CuClad® Series

Rogers Corporation’s CuClad® laminates are woven fiberglass reinforced PTFE based composites for use as PCB substrates and radomes in high frequency applications.

DiClad® Series Laminates

Rogers Corporation’s DiClad® laminates are fiberglass reinforced PTFE based composites for use as printed circuit board substrates in high frequency applications.

IM Series™ Laminates

Rogers Corporation’s IM Series™ laminates extend the capabilities of the successful AD300D™, AD255C™ and DiClad® 880 product grades.

IsoClad® Series Laminates

IsoClad® laminates are non-woven fiberglass reinforced PTFE based composites for use as printed circuit board substrates.

Kappa® 438 Laminates

Kappa® 438 thermoset laminates are glass reinforced hydrocarbon materials, developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 laminates.

MAGTREX™ Laminates

MAGTREX™ 555 high impedance laminates are the first commercially available low loss laminate with controlled permeability and permittivity.

RO3000® Series

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications.

RO4000® Series

RO4000® hydrocarbon ceramic laminates and prepregs are the industry leader.

RT/duroid® Laminates

RT/duroid® high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.

TC Series® Laminates

Rogers Corporation’s TC Series® laminates are PTFE, woven fiberglass and high thermal conductivity ceramic filled materials that provide improved PBC thermal management for applications requiring high power RF signals.

TMM® Laminates

Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity.

XtremeSpeed™ RO1200™ Series 

Rogers Corporation’s XtremeSpeed™ RO1200™ laminates and bondplys are low dielectric constant, low loss materials engineered to meet the unique electrical, thermal and mechanical requirements of high speed designs.

RF Solutions Prepregs and Bondplys

Designed for consistent reliability and performance for the most demanding multi-layer PWB applications.

2929 Bondply Series

Rogers 2929 bondply is an unreinforced, thermoset based, thin film adhesive system.

92ML™ Materials

92ML™ Materials are halogen-free, flame retardant, ceramic-filled thermally conductive multifunctional epoxy prepreg and laminate systems.

CuClad® 6250 Bonding Film

  • Dk or 2.32
  • Ethylene-acrylic acid thermoplastic copolymer bonding film

CuClad® 6700 Bonding Film

  • Dk of 2.35
  • Chloro-trifluoroethylene (CTFE) thermoplastic copolymer bonding film

COOLSPAN® TECA Film

COOLSPAN® Thermally and Electrically Conductive Adhesive (TECA) is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards.

RO4400™/RO4400T™ Series Bondply

  • Prepreg family based on RO4000 series core materials.
  • Sequential lamination capable
  • Lead free soldering capable
  • Thinner options for improved multilayer design flexibility

SpeedWave® 300P Prepreg

SpeedWave® 300P prepreg is a low dielectric constant, ultra-low loss resin material system that can be used to bond a variety of Rogers’ laminates

curamik® Cooling Solutions

A suite of advanced liquid cooling solutions powered by the state of the art curamik® bonding process.

curamik® CoolEasy

  • High precise machined copper cooler
  • Capable of being diamond-milled for laser diode specifications
  • Used with high power laser diodes in the 20-80W range

curamik® CoolPerformance /
curamik® CoolPerformance Plus

  • High performance copper coolers for laser diode applications
  • Cool laser diode bars up to 5 mm cavity length
  • Can be used with high power laser diodes in the 20-100W range
  • curamik CoolPerformance Plus reduces the CTE value to 5-6.5 ppm/K

curamik® CoolPower /
curamik® CoolPower Plus

  • Copper liquid coolers for high power applications
  • Layers hermetically combined without any additional soldering or adhesive
  • curamik CoolPower Plus coolers are integrated Direct Bond Copper (DBC) with ceramic substrates, enabling direct component assembly and electrical isolation from the cooling circuit

curamik® Metallized Ceramic Substrates

Rogers Corporation’s curamik® product suite offers best-in-class metallized ceramic substrates that lead the industry in enabling power electronic printed circuits.

curamik® Performance

  • Based on Si3N4 ceramics and produced in Active Metal Brazed (AMB) process
  • Used in applications where long lifetime, high power density and robustness are required
  • Offers thermal conductivity of 90 W/m K @ 20°C
  • Available in 6 thickness combinations
  • CTE of 2.5 ppm/K @ 20°C - 300°C

curamik® Power

  • Al2O3 provides best price-performance ratio
  • Offers sufficient thermal and mechanical properties for the most common applications
  • Offers thermal conductivity of 24 W/m K @ 20°C
  • Available in many thickness combinations
  • CTE of 6.8 ppm/K @ 20°C - 300°C

curamik® Power Plus

  • HPS substrates provide enhanced robustness through Zr doped Al2O3 ceramics
  • Used in medium power output applications
  • Offers thermal conductivity of 26 W/m K @ 20°C
  • Available in many thickness combinations
  • CTE of 7.1 ppm/K @ 20°C - 300°C

curamik® Thermal

  • Based on AlN ceramics and combines excellent thermal conductivity with good mechanical stability
  • Used in very high operational voltage and power density applications
  • Offers thermal conductivity of 170 W/m K @ 20°C
  • Available in many thickness combinations
  • CTE of 4.7 ppm/K @ 20°C - 300°C

curamik® Endurance

  • Available in multiple ceramic types, including Al2O3 , HPS (ZTA), AlN
  • Enhanced reliability performance compared to material combinations of the same dimensions

ROLINX® Busbar Solutions

Rogers Corporation’s ROLINX® busbars are the global industry leader. Laminated busbars are engineered components used for power distribution.

ROLINX® CapLink Solutions

  • Unique soldering process mounts capacitors to ROLINX laminated busbars
  • Produces small, lightweight assemblies with extremely low inductance and high power density
  • Supports SiC technology

ROLINX® Compact

  • Most optimal connection solution for high power distribution in very limited space
  • Uses powder coating as outer insulation instead of insulation films, allowing for even greater compactness than a laminated busbar
  • Easy and quick to install
  • High power density capabilities and high temperature resistance

ROLINX® Easy

  • Most cost-efficient, simplified busbar solution
  • Designed to replace stacked busbars and simplify the supply chain

ROLINX® Flex

  • Flexible busbar with pure copper laminates
  • Offers flexibility for customized solutions
  • Space saving, easy and quick bending
  • Available in standard and customized length

ROLINX® Housing Solutions

  • Combines injection molding solutions with ROLINX busbar
  • Offers great flexibility for customized solutions
  • Features integration of connectors or structural functions

ROLINX® Hybrid

  • Combination of power and signal (logic) electronics on a single circuit
  • One-piece busbar solution reduces installation time and eliminates wiring errors
  • Simplifies the supply chain with a single-piece solution
  • Features integrated connectors and surface mount components

ROLINX® Performance

  • State-of-the-art laminated busbar technology for demanding, high power applications
  • Provides optimized inductance and controls partial discharge
  • Shaped to fit high voltage applications
  • Compact design

ROLINX® PowerCircuit Solution

  • Combines the advantages of PCB and laminated busbar
  • Meets the needs of low power applications with currents greater than 100 Amps
  • Fit for high volume assembly processes and interconnection techniques
  • Compact 3D design & wave soldering capability

ROLINX® Thermal

  • Enables existing power system design to be upgraded to a higher power level
  • Extended temperature 130 deg. C range and humidity rating
  • Allows for more power through the same copper section

Markets

Rogers partners with customers in a wide range of industries, providing advanced materials to power, protect and connect our world.

Articles

View technical articles by Rogers engineers, featured in industry magazines.

Read Articles

Distributors

US and Canada: Rogers exclusively distributes RF Solutions materials in the US and Canada through International Electronic Components (IEC).

Contact IEC

Europe: Rogers exclusively distributes RF Solutions materials in the European Community (except Spain and Italy) through CCI Eurolam (CCI).

Contact CCI

Tools

Document Library

Search our entire library for documents, including data sheets, technical information and more.

Search

Support

Advanced Electronics Solutions

Find local representatives for personalized support.

ROG Blog

The Rog Blog is contributed by John Coonrod and various other experts from Rogers Corporation, providing technical advice and information about RF/microwave materials.

Read the ROG Blog

HKPCA - Shenzhen, China

December 08, 2021 - December 10, 2021

IPC APEX Expo - San Diego, CA

January 25, 2022 - January 27, 2022

Booth #3433

SPIE Photonics West - San Francisco, CA

January 25, 2022 - January 27, 2022

Booth #4231

European Microwave Week - London, United Kingdom

February 15, 2022 - February 17, 2022

DesignCon 2022 - Santa Clara, CA

April 05, 2022 - April 07, 2022

Booth #518