SpeedWave 300P prepreg is offered with multiple spread and open weave glass style and resin content combinations to maximize stackup options. This material exhibits excellent fill and flow capability around heavy copper features, a low z-axis expansion for plated through hole reliability and is CAF resistant. SpeedWave 300P prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
|Description||Language||File Type||File Size|
|SpeedWave® 300P Data Sheet||English||
|SpeedWave 300P 半固化片数据资料表||中文||
|SpeedWave 300P Prepreg Fabrication Guidelines||English||
|SpeedWave 300P 半固化片加工指南||中文||
|SpeedWave 300P Prepreg - SDS||English||
|SpeedWave 300P Prepreg - SDS||中文||