RO4000 dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. RO4003C™, RO4350B™ and RO4000 LoPro® glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant (Dk), or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.


  • Prepreg grades based on RO4000 series core materials
  • Low z-axis coefficient of thermal expansion ranging from 43 to 60 ppm/°C
  • Sequential lamination capable
  • Lead free solder processing compatible


  • Compatible in multi-layer board constructions with RO4003C, RO4350B, RO4835™, RO4360G2™ or RO4000 LoPro laminates.
  • CAF resistant
  • High frequency thermoset prepreg compatible with FR-4 bond temperatures
  • High reliability plated through-hole



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