RT/duroid 5870 laminates offer high frequency with low dielectric constant (Dk). The randomly oriented microfibers in the PTFE composites result in exceptional Dk uniformity. With its low Dk loss, RT/duroid 5870 laminates are well suited for high frequency/broadband applications where dispersion and losses need to be minimized.

Features

  • Dk of 2.33 +/- .02
  • Dissipation factor of .0012 at 10GHz
  • Low moisture absorption
  • Isotropic

Benefits

  • Lowest electrical loss for reinforced PTFE material
  • Easily cut, shared and machined to shape
  • Resistant to solvents and reagents used in etching or plating edges and holes
  • Ideal for high moisture environments
  • Well-established material
  • Uniform electrical properties over wide frequency range

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

RT/duroid® 5870 RT/duroid® 5880
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 2.33 +/- 0.02 2.20 +/- 0.02
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 2.33 2.20
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0012 0.0009
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) -115 -125
Volume Resistivity Mohm (Typical) 2x107 2x107
Surface Resistivity Mohm (Typical) 2x107 3x107
Water Absorption D48/50% (Typical) 0.02 0.02
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.22 0.20
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 22 31
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 28 48
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 173 237
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 27.2 (4.8) 31.2 (5.5)
Density gm/cm3 (Typical) 2.2 2.2
Flammability Rating UL94 V-0 V-0
Lead-Free Process Compatible Y Y
PIM dBc Typical

Downloads

Description Language File Type File Size
Data Sheet
RT/duroid® 5870 - 5880 Data Sheet English
695KB
RT/duroid® 5870 5880 数据资料表 中文
781KB
Fabrication Information
Fabrication Guidelines RT/duroid 5870-5880 High Frequency Circuit Materials English
207KB
How to Avoid Creep on Board Assemblies English
90KB
After Etch Stress Relief in RT/duroid Microwave Laminates English
76KB
Safety Notes on Using PTFE Composite Material English
63KB
Electrical Design Data
Line Widths for Various Characteristic Impedances of Centered Stripline Devices in a Variety of RT/duroid High Frequency Laminates English
86KB
Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current English
80KB
Design Equations for Broadside and Edgewise Stripline English
147KB
Properties - Detailed Characteristics
The Advantage of Nearly Isotropic Dielectric Constant of RT/duroid 5870-5880 Glass Microfiber PTFE English
83KB
A Study of Solder Temperature Effect of Copper Foil Adhesion to RT/duroid 5870 Material English
73KB
Copper Foils for High Frequency Circuit Materials English
908KB
RT/duroid PTFE-Based Composite Meets Flammability Requirements for Oxygen Environments English
44KB
Good Performance of RT/duroid Microwave Laminate in a Cryogenic Stripline Application at NASA English
52KB
Low Outgassing Characteristics of Rogers Laminates Approved for Spacecraft Applications English
101KB
The Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear Radiation English
68KB
高频电路材料之铜箔概述 中文
894KB
(M)SDS/PSIS
RT/duroid 5870 Laminates - PSIS English
168KB
RT/duroid 5870 Laminates - SDS 中文
341KB
RT/Duroid 5870 Laminates - SDS Française
46KB
RT/duroid 5870 Laminates - SDS Español
45KB

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