RT/duroid 6002 laminates are low loss materials that provide excellent high frequency performance. With excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.

Features

  • Dielectric constant (Dk) of 2.94 +/- .04
  • Low thermal coefficient of Dk at 12 ppm/°C
  • Dissipation factor of .0012 at 10GHz
  • Low Z-axis coefficient of thermal expansion at 24 ppm/°C

Benefits

  • Low loss for excellent high frequency performance
  • Tight thickness control
  • In-plane expansion coefficient matched to copper
  • Low out-gassing; Ideal for space applications
  • Excellent dimensional stability

Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.

RT/duroid® 6002
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) 2.94+/-0.04
Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) 2.94
Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) 0.0012
Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) 12
Volume Resistivity Mohm (Typical) 1x106
Surface Resistivity Mohm (Typical) 1x107
Water Absorption D48/50% (Typical) 0.02
Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 0.60
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X 16
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y 16
Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z 24
Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) 8.9 (1.6)
Density gm/cm3 (Typical) 2.1
Flammability Rating UL94 V-0
Lead-Free Process Compatible Y
PIM dBc Typical

Downloads

Description Language File Type File Size
Data Sheet
RT/duroid® 6002 Laminate Data Sheet English
308KB
RT/duroid® 6002 数据资料表 中文
846KB
Fabrication Information
Fabrication Guidelines RT/duroid 6002-6006-6010 High Frequency Circuit Materials English
263KB
After Etch Stress Relief in RT/duroid Microwave Laminates English
76KB
Safety Notes on Using PTFE Composite Material English
63KB
The Prevention and Removal of Absorbed Chemicals in Ceramic Filled PTFE Composites English
76KB
Guidelines for Drilling RT-duroid 6002 Bonded Assemblies and Multilayer Boards English
50KB
RT/duroid® 6002 Microwave Laminates Direct Bonding English
157KB
Electrical Design Data
Line Widths for Various Characteristic Impedances of Centered Stripline Devices in a Variety of RT/duroid High Frequency Laminates English
86KB
Temperature Rise Estimations in Rogers High Frequency Circuit Boards Carrying Direct or RF Current English
80KB
Design Equations for Broadside and Edgewise Stripline English
147KB
Properties - Detailed Characteristics
Copper Foils for High Frequency Circuit Materials English
908KB
Low Outgassing Characteristics of Rogers Laminates Approved for Spacecraft Applications English
101KB
The Effect of Exposure of RT/duroid PTFE-Based Composites to Nuclear Radiation English
68KB
The Benefits of Selecting RT/duroid 6010LM for Band Pass Filters English
409KB
高频电路材料之铜箔概述 中文
894KB
(M)SDS/PSIS
RT/duroid 6002 Laminates - PSIS English
166KB
RT/duroid 6002 Laminates - PSIS 中文
139KB
RT/Duroid 6002 Laminates - SDS Française
44KB

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