RT/duroid 6006 and 6010.2LM laminates provide high dielectric constants (Dk) to enable circuit size reduction. Both of these materials are low loss, ideal for operating at X-band or below. Additionally, their tight Dk and thickness control deliver repeatable circuit performance.
RT/duroid 6006 laminates
RT/duroid 6010.2LM laminates
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| RT/duroid® 6002 | RT/duroid® 6010.2LM | |
|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.94+/-0.04 | 10.20+/-0.25 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.94 | 10.7 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0012 | 0.0023 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | 12 | -425 |
| Volume Resistivity Mohm (Typical) | 1x106 | 5x105 |
| Surface Resistivity Mohm (Typical) | 1x107 | 5x106 |
| Water Absorption D48/50% (Typical) | 0.02 | 0.01 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.60 | 0.86 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 16 | 24 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 16 | 24 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 24 | 47 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 8.9 (1.6) | 12.3 (2.1) |
| Density gm/cm3 (Typical) | 2.1 | 3.1 |
| Flammability Rating UL94 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y |
| PIM dBc Typical |
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