RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.


  • Dielectric constant of 3.50 +/- .05
  • Dissipation factor of .0013 at 10GHz
  • Thermal conductivity of 1.44 W/m/K at 80°C
  • Thermally stable low profile and reverse treat copper foil


  • High thermal conductivity
  • Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
  • Excellent high frequency performance
  • Lower insertion loss and excellent thermal stability of traces



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