RT/duroid 6202 high frequency laminates offer electrical and mechanical properties essential in designing complex microwave structures that are mechanically reliable and electrically stable. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.


  • Dielectric constant (Dk) of 2.94 ±0.04 to 3.06 ±0.04 depending on thickness
  • Low dissipation factor of .0015 at 10GHz
  • Low thermal coefficient of Dk at 5 ppm/°C
  • Tight thickness control


  • Low loss for excellent high frequency performance
  • In-plane expansion coefficient matched to copper
  • Excellent electrical and mechanical properties
  • Very low etch shrinkage



Explore our calculators, conversion tools, technical papers and more.

Need a Sample?

Samples can be requested through our online request system.

Sample Requests


Advanced Electronics Solutions

Find local representatives for personalized support.