CLTE laminates have proven excellent dimensional stability and low planar CTE, providing consistent performance for embedded resistors: among the lowest variance available for PTFE-based laminates. CLTE laminates have a long history of use with Resistor Foil and are available with a full range of other cladding types (including electrodeposited, reverse treated copper, rolled copper foil or more). CLTE laminates’ tried and tested performance continues to make them a top choice for a wide range of ground-based and airborne communications and radar systems.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| CLTE™ | CLTE-XT™ | |
|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.98+/-0.04 | 2.94+/-0.03* |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.98 | 2.94 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0023 | 0.0012 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -9 | -9 |
| Volume Resistivity Mohm (Typical) | 1.4x109 | 4.3x108 |
| Surface Resistivity Mohm (Typical) | 1.3x106 | 2.5x108 |
| Water Absorption D48/50% (Typical) | 0.0422 | 0.0222 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.50 | 0.56 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 9.9 | 12.7 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 9.4 | 13.7 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 57.9 | 40.8 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 7.0 (1.25) | 7.2 (1.29) |
| Density gm/cm3 (Typical) | 2.38 | 2.02 |
| Flammability Rating UL94 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y |
| PIM dBc Typical |
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