By using fewer plies of woven fiberglass and a higher ratio of PTFE content, the DiClad 870 and DiClad 880 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness to other laminates in the DiClad® series.
Please see below for a sampling of data for this material formulation. For detailed material information and to use advanced features such as filtering, visit the Laminate Properties Tool.
| DiClad® 527 | DiClad® 870 | DiClad® 880 | |
|---|---|---|---|
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Process) | 2.40-2.60+/-0.04 | 2.33+/-0.04 | 2.17, 2.20+/-0.02 |
| Dielectric Constant, @10GHZ (2.5 GHz) Typical (Design) | 2.40-2.60 | 2.33 | 2.2 |
| Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical) | 0.0017 | 0.0013 | 0.0009 |
| Thermal Coefficient εr -50°C to 150°C ppm/°C (Typical) | -153 | -161 | -160 |
| Volume Resistivity Mohm (Typical) | 1.2x109 | 1.5x109 | 1.4x109 |
| Surface Resistivity Mohm (Typical) | 4.5x107 | 3.4x107 | 2.9x106 |
| Water Absorption D48/50% (Typical) | 0.0322 | 0.0222 | 0.0222 |
| Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470 | 0.25 | 0.26 | 0.26 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) X | 14 | 17 | 25 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Y | 21 | 29 | 34 |
| Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical) Z | 173 | 217 | 252 |
| Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical) | 14.0 (2.50) | 14.0 (2.50) | 14.0 (2.50) |
| Density gm/cm3 (Typical) | 2.31 | 2.26 | 2.23 |
| Flammability Rating UL94 | V-0 | V-0 | V-0 |
| Lead-Free Process Compatible | Y | Y | Y |
| PIM dBc Typical |
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